Solder Bath Thermal Diffusion Member for Uniform Heating

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Solution Overview

Problem

Existing solder bath heating methods, where heaters are fixed to the outer surface, lead to uneven temperature distribution within the solder bath, causing temperature variations in the solder, which can result in soldering defects and reduced heater lifespan due to thermal expansions and inefficient heat diffusion.

Innovation Solution

A solder bath design featuring a thermal diffusion member made of stainless steel mounted on the outer surfaces of the solder bath, with a porous heat insulator and a heating element buried within, allowing for even heat distribution and minimizing heat loss by conducting heat through the thermal diffusion member to the solder bath and solder.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Duration of action of stationary object

If a heater is fixed to the outer surface of the solder bath main body, then the heater lifespan is prolonged and damage from solder erosion is reduced, but the temperature distribution becomes uneven and solder temperature varies

Engineering Contradiction:

Improveheater lifespanVSAvoidsolder temperature uniformity

Core Design Contradiction:

Duration of action of stationary objectVSTemperature

Solution Approach 1:

A thermal diffusion member is introduced as an intermediary between the heater and the solder bath main body. The heater heats the thermal diffusion member, which then uniformly diffuses heat to the solder bath main body, eliminating direct heater-to-bath contact while ensuring uniform temperature distribution.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The heating system is segmented into three distinct functional components: the heater element, the thermal diffusion member, and the solder bath main body. This segmentation allows each component to perform its specific function optimally - the heater generates heat, the diffusion member distributes it uniformly, and the bath maintains the solder.

Inventive Principle:

Principle #1Segmentation

2Reliability

If a heater is fixed to the outer surface of the solder bath main body, then the heater is protected from solder erosion, but thermal expansion causes shortened life of the solder bath main body

Engineering Contradiction:

Improveheater protection from erosionVSAvoidsolder bath main body lifespan

Core Design Contradiction:

ReliabilityVSDuration of action of stationary object

Solution Approach 1:

The thermal diffusion member serves as a mediator that absorbs and distributes thermal expansion forces. It prevents direct transmission of thermal expansion stresses from the heater to the solder bath main body, thereby protecting the bath structure while still enabling effective heat transfer.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Ease of manufacture

If a heater is fixed to the outer surface of the solder bath main body, then the heater can be easily mounted, but heat diffuses into the air causing deteriorated thermal efficiency

Engineering Contradiction:

Improveheater mounting simplicityVSAvoidheat loss to air

Core Design Contradiction:

Ease of manufactureVSLoss of energy

Solution Approach 1:

The thermal diffusion member is designed with selective thermal conductivity - high conductivity toward the solder bath main body for efficient heat transfer, and low conductivity toward the air for heat conservation. This local quality differentiation minimizes energy loss while maintaining mounting simplicity.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution ensures even heating of the solder, reducing the likelihood of soldering defects and extending the lifespan of the solder bath by maintaining consistent temperature and improving thermal efficiency by preventing heat escape into the air.

Implementation Method 1

a heating element that is buried in the porous heat insulator and away from the thermal diffusion member heats the thermal diffusion member by heat of the heating element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a porous heat insulator that is mounted on and attached to the thermal diffusion member

Methodology Applied

Scientific EffectThermal insulation: Thermal Insulation

Implementation Method 3

heats the solder bath main body evenly through thermal diffusion from the thermal diffusion member

Methodology Applied

Scientific EffectThermal diffusion: Diffusion

Implementation Method 4

a heating element that is buried in the porous heat insulator and away from the thermal diffusion member heats the thermal diffusion member by heat of the heating element

Methodology Applied

Scientific EffectJoule heating: Joule Heating

Data Source

PatentEP2202022B1Solder bath and method of heating solder contained in a solder bath

Publication Date: 2012.02.01 SENJU METAL IND CO LTD

Figure 1A~1B
Figure 2A~2C
Figure 3A~3B

AI summary

A solder bath contains a solder bath main body that contains solder, and a heating member that heats the solder. The heating member is mounted on outer surfaces of a bottom and sides of the solder bath main body. The heating member contains a thermal diffusion member that is made of stainless steel, which is mounted on the outer surfaces of a bottom and sides of the solder bath main body, a porous heat insulator that is mounted on and attached to the thermal diffusion member, and a heating element that is buried in the porous heat insulator. The heating element is also away from the thermal diffusion member.