Sharp-Edge Solder Jetting Head to Prevent Paste Accumulation
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Solution Overview
Problem
Conventional solder jetting heads experience solder paste accumulation due to the deformation of solder particles between the tappet and nozzle portions, leading to interference with the exiting solder paste and increased production time and cost.
Innovation Solution
The solder jetting head is designed with a tappet and nozzle configuration that forms a sharp-edge contact, minimizing the contact area and reducing the likelihood of solder particle deformation and accumulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a tappet portion with semispherical shape is used to strike the nozzle portion, then the solder paste can be forced to exit through the nozzle opening, but the solder particles are compressed and deformed between the tappet and nozzle portions, causing accumulation and interference with the jetting process
Solution Approach 1:
The invention applies local quality by creating a sharp-edge contact zone at the striking end of the tappet portion, while the rest of the tappet maintains its cylindrical structure. This localized sharp edge minimizes the contact area with the nozzle portion, preventing solder particle compression and deformation in the critical contact region while maintaining the overall structural integrity of the tappet for effective striking force delivery.
2Manufacturing precision
If the tappet portion forms an enclosing contact with the nozzle portion, then the solder paste deposition amount can be controlled, but the contact between tappet and nozzle causes solder particles to deform and accumulate on the contact surfaces
Solution Approach 1:
The sharp-edge contact configuration creates a localized minimal contact area at the striking end, which maintains the enclosing contact necessary for controlling solder paste deposition while minimizing the area where solder particles can accumulate. This localized quality improvement prevents widespread solder sheet formation on the contact surfaces.
Solution Approach 2:
The invention extracts the harmful compression effect by removing the curved contact surface that causes solder particle deformation. By replacing the semispherical striking end with a sharp edge, the design eliminates the compressive force distribution that leads to solder particle deformation and accumulation, while retaining the essential enclosing contact function.
3Speed
If the tappet portion strikes the nozzle portion with sufficient force, then the solder paste can exit through the nozzle opening at high speed, but the contact surfaces deform softer solder particles into solder sheets that adhere to the contact surfaces
Solution Approach 1:
The sharp-edge contact creates a localized minimal contact area that delivers the striking force efficiently without distributing it over a large surface area. This prevents the solder particles from being compressed into sheets across the contact surfaces, while still providing sufficient force to expel the solder paste through the nozzle opening at the required speed.
Data Source
AI summary
A solder jetting head for depositing a solder paste onto a target surface is provided. The solder jetting head comprising: a tappet portion driven to provide a striking force; and a nozzle portion for forming an enclosing contact with the tappet portion, so as to force the solder paste to exit from a nozzle opening of the nozzle portion, wherein the nozzle portion and the tappet portion are configured to have a sharp-edge contact with each other when forming the enclosing contact.