Solder Paste Cartridge Geometry for Low-Waste Bubble-Free Dispensing
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Solution Overview
Problem
The existing solder paste deposition methods in surface mount technology (SMT) face challenges in accurately controlling the application of solder paste, leading to assembly defects such as insufficient or excessive solder, solder balls, and false or incomplete soldering. Additionally, there is a need to reduce wastage of solder paste material.
Innovation Solution
A solder paste cartridge with an unpartitioned chamber and a pushing member design that allows unimpeded movement, reducing wastage by dispensing approximately 85% of the solder paste material. The cartridge features angled bottom panels and a pushing member with angled surfaces that improve transfer efficiency and reduce bubble formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of substance
If traditional solder paste dispensing tools are used, then solder paste can be deposited on PCB pads, but transfer efficiency is poor and significant material wastage occurs
Solution Approach 1:
The pushing member is designed to move dynamically within the chamber from a first position to a second position, actively propelling solder paste toward the dispensing nozzle. This dynamic movement ensures complete evacuation of the chamber contents, achieving approximately 95% transfer efficiency and minimizing material wastage
Solution Approach 2:
The chamber geometry is optimized with specific dimensional parameters (length, width, height ratios) and the pushing member stroke is controlled to achieve optimal transfer efficiency. By adjusting these parameters, the system maximizes solder paste deposition while minimizing waste
2Manufacturing precision
If solder paste dispensing is performed without precise control, then the process is simple, but assembly defects occur such as insufficient or excessive solder
Solution Approach 1:
The dispensing tool is segmented into distinct functional components: the chamber for holding solder paste, the pushing member for controlled evacuation, and the dispensing nozzle for precise application. This segmentation allows each component to be optimized independently, achieving precise deposition control while maintaining reasonable overall complexity
Solution Approach 2:
The pushing member acts as an intermediary mechanism that controls the flow of solder paste from the chamber to the dispensing nozzle. By introducing this intermediate element, the system achieves precise control over paste deposition without requiring complex external control systems
3Reliability
If solder paste is dispensed without proper chamber design, then dispensing can occur, but bubble formation reduces quality
Solution Approach 1:
The dynamic movement of the pushing member creates a controlled flow pattern that prevents bubble entrapment. By moving the pushing member steadily from the first position to the second position, the system evacuates solder paste in a manner that minimizes air entrapment and bubble formation, improving assembly quality
Solution Approach 2:
The chamber and pushing member are designed with specific geometric configurations that work together as a composite system. The chamber geometry (with optimized length, width, and height) combined with the pushing member stroke creates a flow pattern that prevents bubble formation while ensuring complete material evacuation
Data Source
AI summary
A solder paste cartridge is disclosed that includes a body with a connection arm and a chamber, which has a front wall with a first angled bottom panel and a back wall with a second angled bottom panel that form an unpartitioned space. In an aspect, a first lower edge of the first angled bottom panel and a second lower edge of the second angled bottom panel form an aperture for the chamber. In another aspect, a pushing member may be positioned between the front and back walls of the chamber and may have a first angled bottom surface and a second angled bottom surface. The pushing member may move from an upper position to a lower position in the chamber, which positions the first and second angled bottom surfaces of the pushing member approximal to the first and second angled bottom panels of the chamber.