Buffing Apparatus Dual Liquid Supply for Substrate Polishing
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Solution Overview
Problem
Conventional substrate processing apparatuses face challenges in minimizing mechanical damage during polishing, efficiently cleaning foreign matters with high adhesiveness, and optimizing the throughput and liquid consumption in the CMP and finishing units.
Innovation Solution
A buffing apparatus with a rotatable buff table and a buff head equipped with a buff pad, featuring an internal supply line for process liquid and an external nozzle, along with a control section to manage the liquid supply, allowing for uniform and efficient polishing and cleaning while reducing substrate damage and liquid consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a mechanical acting force is increased on the substrate in the polishing unit, then productivity is improved, but substrate damage occurs
Solution Approach 1:
The patent applies preliminary action by supplying process liquid to the substrate before the buff head contacts it. The external nozzle supplies liquid during the approach phase, and the internal supply line activates before contact, ensuring the substrate surface is pre-lubricated and prepared to reduce mechanical damage during high-force polishing
Solution Approach 2:
The process liquid acts as an intermediary between the buff head and substrate. It forms a lubricating film that reduces direct mechanical contact and friction, allowing high polishing forces to be applied without causing substrate damage. The dual supply system ensures this intermediary layer is continuously maintained
2Ease of operation
If the buff head is dressed by a dresser disposed on the outside of the buff table, then ease of operation is improved, but process liquid supply uniformity deteriorates
Solution Approach 1:
The patent segments the process liquid supply system into two independent parts: an external nozzle for preliminary supply during approach and dressing operations, and an internal supply line integrated into the buff head for contact-phase supply. This segmentation allows the external dresser to operate freely while the internal system ensures uniform distribution at the contact interface
Solution Approach 2:
The process liquid supplied by the internal supply line acts as an intermediary that compensates for the external dresser configuration. By delivering liquid directly at the contact interface between buff head and substrate, it ensures uniform distribution regardless of where the dressing operation occurs
3Device complexity
If process liquid is supplied only by the internal supply line, then device complexity is reduced, but productivity deteriorates due to insufficient liquid supply during head movement
Solution Approach 1:
The external nozzle performs preliminary action by supplying process liquid to the substrate before the buff head approaches and during its movement. This advance supply ensures liquid is already present on the substrate surface, eliminating delays and ensuring immediate effective polishing contact, thereby improving throughput
Solution Approach 2:
The patent implements a dynamic dual-supply system where the external nozzle operates during approach and movement phases, while the internal supply line operates during contact phases. This dynamic coordination ensures continuous adequate liquid supply throughout all operational stages, improving productivity without excessive complexity
4Manufacturing precision
If the diameter of the contact member is smaller than the diameter of the substrate, then manufacturing precision is improved for additional polishing, but cleaning efficiency deteriorates for foreign matters with large adhesiveness
Solution Approach 1:
The patent applies hydraulic principles by using process liquid supplied through both external and internal systems to create a fluid film between the contact member and substrate. This liquid medium enhances the removal of adhesively bonded foreign matters through hydrodynamic forces, compensating for the smaller contact area and improving cleaning efficiency while maintaining precision polishing capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The buffing apparatus effectively performs finish polishing, reduces substrate damage, enhances cleaning efficiency, and improves throughput by ensuring adequate process liquid supply, even when the buff head is dressed externally, thereby addressing the limitations of conventional methods.
Implementation Method 1
The buffing apparatus includes: a buff table for holding the substrate, the buff table being rotatable; and a buff head to which a buff pad for buffing the substrate is attachable. The buff head is rotatable and movable
Implementation Method 2
perform finish polishing while suppressing damage to (a defect of) the substrate
Implementation Method 3
An internal supply line for supplying process liquid for the buffing to the substrate is formed inside the buff head
Implementation Method 4
The buffing apparatus further includes an external nozzle provided separately from the internal supply line in order to supply the process liquid to the substrate
Implementation Method 5
it is possible to efficiently clean and remove foreign matters and the like having large adhesiveness
Data Source
AI summary
A buffing apparatus for buffing a substrate is provided. The apparatus includes: a buff table for holding the substrate, the buff table being rotatable; a buff head to which a buff pad for buffing the substrate is attachable, the buff head being rotatable and movable in a direction approaching the buff table and a direction away from the buff table, and an internal supply line for supplying process liquid for the buffing to the substrate being formed inside the buff head; and an external nozzle provided separately through the internal supply line in order to supply the process liquid to the substrate.