Lapping Machines TRIZ Cases
- Polishing System Platen Edge Control via Deflectable Flange
Deflectable annular flange applies localized pressure to correct substrate edge non-uniformity without adding separate polishing stations.
- Silicon Wafer Polishing Slurry Recycling with Chelating Agent Control
Adding a chelating agent to recycled slurry stabilizes composition and reduces metal impurity contamination without introducing unused abrasive grains.
- Temperature-Responsive Polishing Agent for CMP Viscosity Control
Organic polymer polishing agent switches between gel and sol states to adjust viscosity dynamically.
- Transparent Holding Table Foreign Object Exclusion
Segmenting imaging into table and workpiece steps excludes scratches from detection, maintaining measurement precision.
- Polishing Table Replacement Apparatus with Tilting Stage
A crane moves a polishing table vertically and horizontally while a tilting stage adjusts its orientation for precise placement.
- Thermal Imaging Surface Processing Auxiliary System
A thermal imaging surface processing auxiliary system adjusts grinding tool speed based on real-time temperature changes detected by a sensor.
- Autoencoder Wafer Type Detection in Optical Film Thickness Measurement
An autoencoder analyzes reflected light spectra to identify wrong workpieces during polishing.
- Grinding Apparatus Support Pole Air Cooling
Air flows through support pole through-holes to prevent thermal expansion and inclination changes during wafer grinding.
- Polishing Section Transport Mechanism for Substrate Processing
Dedicated transport routes eliminate congestion and contamination risks during substrate processing.
- Heat Exchanger Protrusions for CMP Slurry Flow
Protruding portions on a chemical mechanical polishing heat exchanger redirect slurry flow to the pad interface.
- Multiple Disk Pad Conditioner for CMP Slurry Removal
Segmented conditioning heads rotate and press against polishing pads, reducing conditioning time while extending element life.
- Wafer Pin Chuck Flatness Repair Using Toroidal Lapping
Toroidal lapping tool restores flatness on wafer pin chucks, correcting mid-spatial frequency errors from non-uniform pin distribution.
- Polishing Pad Alignment Feature for CMP Orientation
Radial or circumferential grooves provide persistent traceability without disrupting vacuum application.
- Grinding Apparatus Sub-Chuck Table Height Measurement
A grinding apparatus measures sub-chuck table height to calculate workpiece thickness using a movable measuring unit mechanism.
- Optical Surface Monitoring Light Passage Cleaning
Chemical liquid dissolves abrasive grains in the light passage, preventing measurement errors without continuous water supply.
- Offset Mechanism for Uniform Substrate Polishing
Dynamic carrier offset via an elastic membrane eliminates circumferential film thickness variations in chemical mechanical polishing.
- Thermoplastic Polyurethane Polishing Pad for Metal Layer Planarization
A thermoplastic polyurethane polishing pad with controlled storage elastic modulus balances planarization efficiency and surface protection.
- Semiconductor Wafer Back-Grinding Defect Reduction
Embedded sensors and statistical process control adjust taping pressure to prevent wafer warpage and breakage.
- Movable Retainer Rings for Intermittent Slurry Supply in CMP
A movable retainer ring opens and closes trenches to intermittently supply polishing solution onto the polisher.