Buffing Pad With Segmented Protrusions and Trenches
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current chemical mechanical polishing (CMP) systems face challenges in effectively removing scratches and small particles from large-diameter substrates during buffing treatments, leading to reduced polishing efficiency and potential substrate damage.
Innovation Solution
A buffing treatment module with a buffing pad featuring a circular base unit, protrusion units, and trench units that rotate in contact with the substrate, designed to facilitate even distribution of treatment liquids and reduce scratches, includes a central trench unit and varying trench widths to enhance liquid discharge and polishing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a conventional buffing pad is used, then the structure is simple, but it cannot effectively remove scratches and small particles from large-diameter substrates
Solution Approach 1:
The buffing pad is divided into multiple functional regions: a central region with first protrusions for polishing, peripheral regions with second protrusions for cleaning, and intermediate transition regions. This segmentation allows different areas to perform specialized functions, enabling effective removal of scratches and particles while maintaining structural organization.
Solution Approach 2:
Different regions of the buffing pad are assigned different local properties: the central region has properties optimized for polishing (first protrusions), while peripheral regions have properties optimized for cleaning (second protrusions). This local differentiation enables the pad to address different surface conditions at different locations simultaneously.
2Productivity
If the buffing pad structure is simplified, then the device complexity is reduced, but the polishing efficiency and particle removal capability deteriorate
Solution Approach 1:
The buffing pad is divided into multiple functional regions: a central region with first protrusions for polishing, peripheral regions with second protrusions for cleaning, and intermediate transition regions. This segmentation allows different areas to perform specialized functions, enabling effective removal of scratches and particles while maintaining structural organization.
Solution Approach 2:
The buffing pad incorporates a three-dimensional layered structure with multiple protrusion types at different heights and positions. This dimensional complexity enables simultaneous polishing and cleaning actions across different zones, significantly improving productivity without requiring multiple separate tools.
3Manufacturing precision
If treatment liquids are distributed evenly, then the polishing quality improves, but the liquid discharge efficiency decreases
Solution Approach 1:
The buffing pad is divided into multiple functional regions: a central region with first protrusions for polishing, peripheral regions with second protrusions for cleaning, and intermediate transition regions. This segmentation allows different areas to perform specialized functions, enabling effective removal of scratches and particles while maintaining structural organization.
Solution Approach 2:
The buffing pad incorporates a liquid distribution system with channels and cavities that utilize hydraulic principles to distribute treatment liquids evenly across the polishing and cleaning regions. The three-dimensional structure includes liquid transport pathways that maintain pressure differential for efficient liquid discharge while ensuring uniform coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively suppresses substrate scratches and efficiently removes small particles, maintaining high polishing speed while preventing damage, even on large-diameter substrates.
Implementation Method 1
a buffing pad attached to a lower part of the buffing head and rotating while in contact with the substrate for performing buffing treatment on the substrate
Implementation Method 2
a plurality of trench units positioned adjacent to the plurality of protrusion units, and extending from a center portion of the base unit to an edge portion of the base unit
Data Source
AI summary
A buffing treatment module includes: a buffing table that supports a substrate; a buffing head located on the buffing table and configured to rotate; and a buffing pad attached to a lower part of the buffing head and rotating while in contact with the substrate for performing buffing treatment on the substrate, wherein the buffing pad includes: a base unit; a plurality of protrusion units that protrude from a surface of the base unit and are spaced apart from each other in a circumferential direction of the base unit; and a plurality of trench units positioned adjacent to the plurality of protrusion units, and extending from a center portion of the base unit to an edge portion of the base unit, wherein the plurality of trench units are spaced apart from each other in the circumferential direction of the base unit.