Resin Member Surface Roughness Control for Contaminant Adhesion
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Solution Overview
Problem
The challenge in electronic device production is the adhesion of contaminants to resin members, leading to contamination and reduced yield, which conventional surface roughness control methods fail to adequately address over a long period.
Innovation Solution
Applying abrasive processing to reduce surface roughness to 100 nm or less and achieving a contact angle of 70° to 110° for pure water on the resin member surface to suppress contaminant adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional surface roughness control methods are used, then manufacturing process is simple, but dust generation and contaminant adhesion cannot be sufficiently suppressed over long period
Solution Approach 1:
The invention changes the surface parameters of the resin member by controlling surface roughness to 10 nm or less and contact angle to 70° or more. This dual parameter control transforms the surface properties to achieve both low dust generation and long-term contaminant adhesion suppression, resolving the contradiction between reliability improvement and processing complexity.
Solution Approach 2:
The invention replaces conventional mechanical surface treatment methods with a combination of abrasive processing and plasma processing. This substitution achieves superior surface quality (Ra ≤ 10 nm) and contact angle control (≥70°) that cannot be obtained by traditional mechanical methods alone, thereby suppressing contaminant adhesion more effectively.
2Object-affected harmful factors
If surface roughness is reduced to improve cleanliness, then contaminant adhesion is reduced, but surface processing complexity increases
Solution Approach 1:
The invention specifies precise parameter ranges: surface roughness Ra of 10 nm or less and contact angle of 70° or more. By controlling these parameters within defined ranges, the resin member achieves reduced contaminant adhesion while providing clear manufacturing guidelines that balance processing complexity with effectiveness.
Solution Approach 2:
The invention uses composite processing methods combining abrasive processing followed by plasma processing. This composite approach achieves the target surface roughness and contact angle more effectively than single methods, reducing contaminant adhesion while managing manufacturing complexity through a systematic multi-step process.
3Reliability
If resin member is used for chemical resistance, then corrosion resistance is improved, but dust generation from surface occurs over time
Solution Approach 1:
The invention changes the surface parameters of the resin member to Ra ≤ 10 nm and contact angle ≥ 70°. This transformation maintains the bulk material's corrosion resistance while modifying the surface properties to minimize dust generation and contaminant adhesion, resolving the contradiction between chemical resistance and dust generation.
Solution Approach 2:
The invention applies surface treatment only to the outer surface of the resin member, preserving the bulk material's chemical and corrosion resistance properties. The surface layer is modified to have low roughness and appropriate hydrophilicity, creating local quality differentiation that prevents dust generation without compromising overall corrosion resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method effectively reduces contaminant adhesion and maintains surface properties over a long period, enhancing the resilience of resin members in electronic device production processes.
Implementation Method 1
a processing step of applying abrasive processing to the surface of a raw member
Implementation Method 2
set the surface roughness Ra to 100 nm or less
Implementation Method 3
set the contact angle of pure water with respect to the surface to 70° or more and less than 110°
Data Source
AI summary
There is provided a method for producing a resin member used in a production process of electronic devices capable of suppressing the adhesion of adhering substances to the surface over a long period of term. The method for producing a resin member used in a production process of electronic devices includes: a processing step of applying abrasive processing to the surface of a raw member to set a surface roughness Ra to 100 nm or less and a contact angle of pure water with respect to the surface to 70° or more and less than 110°.