Polishing Table Replacement Apparatus with Tilting Stage
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Solution Overview
Problem
The existing methods for replacing large polishing tables in semiconductor-device manufacturing machines require extensive maintenance space and involve the use of heavy lifting devices, making it difficult to manage the center of gravity and navigate through restricted factory paths.
Innovation Solution
A polishing table replacement apparatus with a crane that can move the table vertically and horizontally, a tilting table stage mechanism, and a component replacement apparatus with a movable frame and crane that can be elevated and lowered, allowing for the reduction of the center of gravity and elimination of the need for a dedicated device to lift the joint bracket.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If the polishing table diameter is increased to accommodate larger wafer sizes, then the wafer processing capability is improved, but the maintenance space required for replacing the polishing table exceeds the available factory footprint
Solution Approach 1:
The invention changes the replacement approach from horizontal movement to vertical lifting. The polishing table is lifted vertically by a lifter mechanism and transferred to a reception stage positioned above the CMP apparatus, eliminating the need for large horizontal maintenance space while accommodating larger polishing table diameters
Solution Approach 2:
The invention introduces a reception stage as an intermediary component positioned above the CMP apparatus. The polishing table is transferred from the CMP apparatus to this intermediate stage, enabling vertical replacement without requiring extensive horizontal space for direct placement
2Reliability
If the lifter fixing frame is positioned at the same height as the upper frame to stabilize the lifter, then the lifting stability is improved, but the center of gravity of the lifter becomes high causing instability during movement
Solution Approach 1:
The invention divides the lifter system into separate functional components: a movable lifter body for lifting operations and a fixed upper frame for structural support. The lifter body can be positioned with its center of gravity low for stability during movement, while the upper frame provides the necessary fixing points for lifting stability
Solution Approach 2:
The invention separates the lifting function from the fixing function in the vertical dimension. The lifter body moves vertically to perform lifting with a low center of gravity, while the fixing frame remains at the upper frame height to provide stable attachment points, resolving the contradiction between movement stability and lifting stability
3Reliability
If a wide-shaped lifter is used to prevent falling over during movement, then the lifting stability is improved, but the lifter cannot be smoothly introduced into the factory due to restricted path width
Solution Approach 1:
The invention separates the lifter body from the fixing frame, allowing the lifter body to be narrow for easy factory movement while the fixed upper frame provides the necessary structural support and stability during lifting operations
Solution Approach 2:
The invention moves the stability-providing structure (upper frame) to a different vertical position rather than increasing the horizontal width of the lifter. This allows the lifter body to remain narrow for factory navigation while the elevated upper frame provides the necessary stability during lifting
4Ease of manufacture
If an additional lifting device is prepared to lift the joint bracket, then the joint bracket can be attached to the upper frame, but the device complexity and cost increase
Solution Approach 1:
The invention combines the joint bracket lifting function with the main lifter mechanism. The lifter that is already required for polishing table replacement is used to also lift and position the joint bracket, eliminating the need for a separate dedicated lifting device
Data Source
AI summary
An apparatus for replacing a polishing table, which is used in a polishing apparatus for polishing a substrate such as wafer, is disclosed. The polishing table replacement apparatus (10) is used for removing a polishing table (3) from a polishing apparatus (1). This polishing table replacement apparatus (10) includes a crane (10) configured to move the polishing table (3) vertically and horizontally, a table stage (14) on which the polishing table (3) can be placed, and a table-stage tilting mechanism (15) configured to tilt the table stage (14).