CMP Polishing Apparatus Fence Fluid Segmentation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing CMP process faces challenges in optimizing the surface temperature of the polishing pad and preventing the mixing of temperature control fluid and slurry, which affects the polishing efficiency and increases manufacturing costs.
Innovation Solution
A polishing apparatus with a temperature control unit and a slurry supply unit positioned along the rotational direction of the platen, featuring a first fence between the temperature control unit and the slurry supply unit to control the flow of temperature control fluid and prevent mixing with the slurry, ensuring optimal surface temperature control of the polishing pad.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If temperature control fluid is sprayed onto the polishing pad to control temperature, then surface temperature optimization is achieved, but mixing with slurry occurs reducing efficiency
Solution Approach 1:
The polishing pad surface is segmented into distinct functional zones using fences: a first zone for temperature control fluid application, a second zone for slurry application, and a third zone for polishing operations. This spatial segmentation prevents mixing of temperature control fluid and slurry while allowing each to perform its specific function effectively.
Solution Approach 2:
Fences are introduced as intermediary structures between the temperature control fluid application area and the slurry application area. These fences act as physical barriers that prevent direct mixing of the two fluids while still allowing the polishing process to proceed efficiently in the designated zones.
2Manufacturing precision
If temperature control fluid and slurry are applied separately to optimize temperature, then polishing quality improves, but device complexity increases
Solution Approach 1:
The polishing pad is divided into multiple functional zones with distinct purposes: a temperature control zone, a slurry application zone, and a polishing zone. Each zone is separated by fences, allowing independent control of fluid application while maintaining overall system simplicity through clear functional differentiation.
3Temperature
If temperature control fluid flows freely to ensure temperature control, then temperature optimization is achieved, but excessive slurry usage occurs increasing costs
Solution Approach 1:
The temperature control fluid application is extracted and separated from the slurry application area by using fences to define distinct zones. This allows the temperature control fluid to flow freely in its designated zone without contaminating the slurry supply system, thereby preventing excessive slurry usage and reducing material costs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration optimizes the surface temperature of the polishing pad, preventing the mixing of temperature control fluid and slurry, thereby enhancing polishing efficiency while reducing costs associated with excessive slurry usage.
Implementation Method 1
a temperature control unit configured to spray a temperature control fluid to control a temperature of the polishing pad onto the polishing pad
Implementation Method 2
a first fence between the temperature control unit and the slurry supply unit along the rotational direction, and extending from a center of the polishing pad outwardly to control a flow of the temperature control fluid
Implementation Method 3
a polishing head on the polishing pad to be spaced apart from the slurry supply unit along the rotational direction, and configured to rotate a semiconductor substrate in contact with the polishing pad
Data Source
AI summary
A polishing apparatus for a substrate, includes: a platen having a polishing pad attached to an upper surface thereof, and configured to rotate in a rotational direction, a temperature control unit configured to spray a temperature control fluid onto the polishing pad, a slurry supply unit configured to supply a slurry to the polishing pad, a polishing head on the polishing pad, and configured to rotate a semiconductor substrate in contact with the polishing pad, and a first fence between the temperature control unit and the slurry supply unit extending from a center outwardly, along the rotational direction, to control a flow of the temperature control fluid, wherein the temperature control unit, the slurry supply unit, and the polishing head are sequentially positioned along the rotational direction.