Polishing Section Transport Mechanism for Substrate Processing
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Solution Overview
Problem
Conventional substrate processing apparatuses face inefficiencies in throughput due to congestion in processing units and contamination risks during wafer transfer, particularly when multiple polishing units are involved, and lack the ability to simultaneously clean and dry multiple wafers effectively.
Innovation Solution
A substrate processing apparatus with a polishing section featuring multiple polishing units and a transport mechanism that includes a transport robot to facilitate efficient transfer between units, along with auxiliary unit mounting units that allow for symmetric placement and easy cleaning, enabling flexible rotation direction adjustment of polishing tables to optimize space and reduce contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single cleaning line is provided in the cleaning section, then the device complexity is reduced, but the productivity is reduced because only one wafer can be cleaned and dried at a time
Solution Approach 1:
The cleaning section is segmented into multiple independent cleaning lines (first cleaning line with first cleaning unit and second cleaning unit, second cleaning line with third cleaning unit and fourth cleaning unit). Each cleaning line can process wafers independently and simultaneously, increasing throughput while maintaining manageable device complexity through modular design.
Solution Approach 2:
Multiple cleaning lines are merged into a single integrated cleaning section, allowing parallel processing of multiple wafers. The transport robot coordinates transfers across all cleaning lines, merging their operations into a unified high-throughput system.
2Device complexity
If wafers are transferred through a common route between polishing units, then the device complexity is reduced, but congestion occurs reducing the productivity
Solution Approach 1:
The transport mechanism is segmented into multiple independent transport routes: first transport route for first polishing unit, second transport route for second polishing unit, third transport route for third polishing unit, and fourth transport route for fourth polishing unit. This segmentation eliminates congestion by providing dedicated pathways for each polishing unit while maintaining overall system simplicity.
3Device complexity
If the transport robot directly transfers wafers between load/unload unit and polishing section, then the device complexity is reduced, but contamination risk increases due to contact with polishing environment
Solution Approach 1:
The transport robot serves as an intermediary that transfers wafers through dedicated transport routes rather than direct contact with polishing sections. The robot hand transfers wafers to transport mechanisms that convey them through isolated pathways, preventing direct contact between the robot and polishing environment while maintaining simple transfer mechanics.
Data Source
AI summary
A substrate processing apparatus includes a polishing section and a transport section. The polishing section has a first polishing unit, a second polishing unit, and a transport mechanism. The first polishing unit has a first polishing apparatus and a second polishing apparatus. The second polishing unit has a third polishing apparatus and a fourth polishing apparatus. Each of the first to fourth polishing apparatuses has a polishing table to which a polishing pad is mounted, a top ring, and auxiliary units that perform a process on the polishing pad during polishing. Around the polishing table, a pair of auxiliary unit mounting units for mounting the respective auxiliary units in a left-right switchable manner with respect to a straight line connecting a swing center of the top ring and a center of rotation of the polishing table is provided at respective positions symmetrical with respect to the straight line.