Movable Retainer Rings for Intermittent Slurry Supply in CMP
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Solution Overview
Problem
The high cost of manufacturing semiconductor devices due to continuous slurry supply in CMP methods and the reduction in polishing speed when slurry supply is decreased, which hampers efficient polishing of semiconductor substrates.
Innovation Solution
A semiconductor manufacturing apparatus with movable retainer rings that intermittently supply slurry by opening and closing trenches to optimize slurry usage, allowing efficient polishing without continuous supply, thereby reducing costs and maintaining polishing speed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If slurry is continuously supplied during polishing, then polishing speed is maintained, but manufacturing cost increases
Solution Approach 1:
The patent implements periodic slurry supply by rotating the carrier to periodically expose different regions of the semiconductor substrate to the polish pad. The carrier rotation creates periodic contact between the substrate and polish pad, allowing slurry to be supplied only during active polishing phases rather than continuously, thereby reducing slurry consumption while maintaining polishing speed.
Solution Approach 2:
The patent employs dynamic control of the carrier rotation speed and position to optimize polishing efficiency. By dynamically adjusting the carrier rotation, the system ensures that slurry is supplied only when the substrate is in contact with the polish pad, adapting the supply timing to the actual polishing needs and reducing waste.
2Quantity of substance
If slurry supply amount is decreased to reduce cost, then manufacturing cost decreases, but polishing speed reduces
Solution Approach 1:
The periodic rotation of the carrier ensures that slurry is supplied at optimal intervals during the polishing process. This periodic supply mechanism maintains sufficient slurry availability at the polish pad-substrate interface to sustain high polishing speed, while avoiding continuous supply that would waste material.
Solution Approach 2:
The patent changes the temporal parameters of slurry supply by controlling the carrier rotation speed and position. This parameter optimization ensures that slurry is supplied at the right moments to maintain polishing speed, achieving efficient use of material without sacrificing productivity.
3Productivity
If carrier rotates to polish substrate, then polishing efficiency improves, but slurry consumption increases
Solution Approach 1:
The carrier rotation creates periodic engagement and disengagement between the substrate and polish pad. During disengagement phases, slurry supply is reduced or stopped, preventing waste while maintaining polishing efficiency during engagement phases. This periodic action optimizes the balance between polishing performance and material consumption.
Solution Approach 2:
The patent extracts the unnecessary continuous slurry supply from the polishing process, retaining only the essential periodic supply that occurs during actual polishing contact. This extraction eliminates waste associated with continuous supply while preserving the core polishing function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus efficiently polishes semiconductor substrates by intermittently supplying slurry, reducing manufacturing costs and maintaining polishing speed, while allowing for controlled slurry usage and efficient polishing.
Implementation Method 1
A first annular part attached to the holder is movable relative to a second annular part attached to the holder, in a rotation direction of the substrate or the holder
Data Source
AI summary
A semiconductor manufacturing apparatus according to the present embodiment has a polisher polishing a substrate. A holder holds the substrate and rotates the substrate with respect to the polisher while pressing the substrate toward the polisher. A supplier supplies a polishing solution onto the polisher. A first annular part is attached to the holder. The first annular part is located around the substrate and between the holder and the polisher, when polishing the substrate. A second annular part is attached to the holder. The second annular part is located around the first annular part and between the holder and the polisher, when polishing the substrate. The first annular part is movable relative to the second annular part or the second annular part is movable relative to the first annular part, in a rotation direction of the substrate or the holder.