Heat Exchanger Protrusions for CMP Slurry Flow

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Solution Overview

Problem

In semiconductor manufacturing CMP apparatuses, the efficient entry of polishing liquid into the area between the polishing pad and the heat exchanger is hindered at low polishing table rotation speeds, leading to inefficient temperature control and polishing efficiency.

Innovation Solution

The incorporation of protruding portions on the side or bottom face of the heat exchanger, such as partition portions and projecting portions, to redirect and ensure the polishing liquid enters the area between the polishing pad and the heat exchanger, facilitating effective temperature control and polishing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the polishing table rotation speed is reduced, then the polishing pressure and contact time increase, but the polishing liquid cannot effectively enter the area between the polishing pad and heat exchanger

Engineering Contradiction:

Improvepolishing uniformityVSAvoidpolishing liquid entry

Core Design Contradiction:

Manufacturing precisionVSQuantity of substance

Solution Approach 1:

The heat exchanger surface is segmented into multiple protruding portions that divide the space between the heat exchanger and polishing pad into multiple channels. This segmentation creates multiple pathways for polishing liquid to penetrate into the gap, ensuring adequate liquid supply even at low rotation speeds where centrifugal force is insufficient.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protruding portions are strategically positioned on the heat exchanger surface to create localized channels that guide polishing liquid flow. This local structural modification ensures that polishing liquid is directed specifically to areas where temperature control is most needed, improving the effectiveness of temperature control without requiring high rotation speeds.

Inventive Principle:

Principle #3Local quality

2Use of energy by moving object

If the polishing table rotation speed is reduced, then energy consumption decreases, but temperature control efficiency deteriorates

Engineering Contradiction:

Improveenergy consumptionVSAvoidtemperature control efficiency

Core Design Contradiction:

Use of energy by moving objectVSTemperature

Solution Approach 1:

By segmenting the heat exchanger surface into multiple protruding portions, the patent creates multiple liquid flow channels that enhance polishing liquid circulation. This allows effective temperature control through improved liquid contact, achieving adequate cooling without requiring high rotation speeds and their associated energy consumption.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protruding portions act as intermediaries that facilitate the interaction between polishing liquid and the heat exchanger-polishing pad interface. These structures guide and distribute the polishing liquid to ensure effective thermal contact, enabling temperature control to function efficiently even when the polishing table rotates slowly.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Manufacturing precision

If the polishing table rotation speed is reduced, then polishing smoothness improves, but polishing efficiency decreases

Engineering Contradiction:

Improvepolishing smoothnessVSAvoidpolishing efficiency

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The segmented protruding portions create multiple liquid channels that maintain effective polishing liquid supply at low rotation speeds. This ensures that the polishing process can proceed efficiently with adequate liquid refreshment, preventing the polishing head from drying out and maintaining consistent polishing action throughout the wafer surface.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The protruding portions ensure continuous and uniform distribution of polishing liquid across the polishing interface, maintaining uninterrupted polishing action. This continuous liquid supply prevents pauses or inconsistencies in the polishing process, thereby maintaining high polishing efficiency even at reduced rotation speeds that provide smoother results.

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution enables efficient temperature control of the polishing pad and slurry, enhancing the polishing rate and efficiency, particularly at low rotation speeds by ensuring the polishing liquid effectively interacts with the heat exchanger.

Implementation Method 1

a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

entry of the polishing liquid into an area between the polishing pad and the heat exchanger is desired

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS10950469B2Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

Publication Date: 2021.03.16 KIOXIA CORP

AI summary

In one embodiment, a semiconductor manufacturing apparatus includes a polishing table configured to hold a polishing pad, a polishing head configured to hold a substrate to be polished by the polishing pad, and a polishing liquid feeder configured to feed a polishing liquid to the polishing pad. The apparatus further includes a heat exchanger configured to be placed on the polishing pad and control temperatures of the polishing pad and the polishing liquid, and one or more protruding portions provided on a side face or a bottom face of the heat exchanger.