Build-Up Wiring Substrate Layout for Dense Routing and Warp Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wiring substrates face challenges in effectively suppressing warping while maintaining a compact thickness and achieving high-density wiring without increasing the overall dimension.
Innovation Solution
A wiring substrate design with a core substrate and build-up parts on both surfaces, featuring a first region with standard conductor layer spacing and a second region with narrower spacing and finer wirings, along with continuous insulating layers, to maintain structural integrity and reduce thickness growth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wiring density is increased by reducing the distance between adjacent conductor layers, then the wiring capacity is improved, but the warping suppression becomes difficult and the thickness increases
Solution Approach 1:
The patent applies local quality by creating a first region with standard conductor layer spacing and a second region with narrower spacing for finer wirings. This allows different areas of the wiring substrate to have different wiring densities according to their specific functional requirements, enabling high-density wiring in the second region while maintaining warping suppression in the first region through continuous insulating layers.
Solution Approach 2:
The patent utilizes the thickness dimension by forming build-up parts with multiple alternately laminated insulating layers and conductor layers. This vertical stacking approach allows increased wiring capacity without proportionally increasing the planar dimensions, while the continuous insulating layers in the thickness direction provide warping suppression.
2Manufacturing precision
If the distance between adjacent conductor layers is reduced to achieve finer wirings, then the wiring precision is improved, but the structural integrity and warping suppression deteriorate
Solution Approach 1:
The patent implements local quality by distinguishing between the first region with standard spacing and the second region with narrower spacing. The continuous insulating layers in the first region maintain structural integrity, while the second region achieves finer wirings where structural requirements are less critical, thus balancing precision and strength.
Solution Approach 2:
The patent employs composite materials through the alternating lamination of insulating layers and conductor layers in the build-up parts. This composite structure provides both the precision needed for fine wirings and the structural integrity required for warping suppression, with each material layer contributing its specific properties to the overall structure.
3Productivity
If multiple insulating layers and conductor layers are laminated to increase wiring capacity, then the wiring density is improved, but the thickness increases
Solution Approach 1:
The patent transitions from two-dimensional planar wiring expansion to three-dimensional vertical stacking by laminating multiple insulating layers and conductor layers alternately. This allows significant increase in wiring density without proportional increase in planar thickness, as the wiring capacity is achieved through vertical layering rather than horizontal expansion.
Solution Approach 2:
The patent applies the nesting principle by placing conductor layers between insulating layers in an alternating sequence, with each conductor layer nested within the insulating layer structure. This nested arrangement maximizes wiring capacity within a compact thickness by efficiently utilizing the available space between insulating layers.
Data Source
AI summary
A wiring substrate includes a core substrate, a first build-up part formed on a first surface of the substrate and including insulating layers and conductor layers, and a second build-up part formed on a second surface of the substate on the opposite side with respect to the first surface and including insulating layers and conductor layers. The first build-up part includes a first region and a second region such that a distance between adjacent conductor layers in the second region is smaller than a distance between adjacent conductor layers in the first region, the conductor layers in the second region include second wirings having the minimum wiring width and the minimum inter-wiring distance that are smaller than the minimum wiring width and the minimum inter-wiring distance of first wirings of the conductor layers in the first region and the insulating layers are continuous in the first region and second region.