Printed Circuits Stress/Warp Reduction TRIZ Cases
- Vehicle Camera Module Hook Coupling for Stable Stacked Substrates
A hook-and-fence support member replaces screw coupling to save mounting space, cut assembly time, and prevent substrate warping.
- Vehicle Camera Module Hook Coupling for Space-Saving Assembly
A hook-coupled substrate structure replaces screws in a vehicle camera module to save mounting space, shorten assembly time, and prevent warping.
- Component Carrier Ultra-Thin Transition Layer for Delamination Control
An ultra-thin transition layer buffers thermal mismatch in component carriers, improving adhesion while suppressing warpage, stress, and delamination.
- Vehicle Camera Module Hook Coupling to Prevent Substrate Warping
A hook-and-adhesive substrate coupling cuts vehicle camera mounting space, speeds assembly, and prevents warping and vibration shake.
- Ceramic Substrate Lamination for Recessed Portion Warpage Control
A shrinkage-suppressing green sheet balances density differences from recessed pressing, reducing ceramic substrate warpage after firing.
- Stacked Spiral Coil Multilayer Substrate for Surface Flatness
Stacked spiral coil patterns on separate insulating layers cut plated surface unevenness while preserving inductance and lowering conductor loss.
- Inter-Board Connector Structure With Vibration Suppression
A second-board vibration suppressor damps board motion to prevent micro-sliding abrasion, rising contact resistance, and connector disconnection.