Substrate with Built-in Component Moisture Vapor Venting
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Solution Overview
Problem
Substrates with built-in electronic components face issues such as cracks in insulating layers and layer separation due to moisture vaporization during reflow soldering, caused by synthetic resin fillers with higher moisture absorbency than the core layer.
Innovation Solution
Incorporating conductive layers with penetrating holes on the surfaces of the substrate to guide moisture vapor away from the insulating layers, reducing vapor pressure and preventing cracks and layer separation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If synthetic resin filler with higher moisture absorbency than core layer is used, then moisture absorption capability is improved, but vapor escape path becomes blocked causing cracks and layer separation
Solution Approach 1:
The patent segments the vapor escape path by creating multiple openings in the conductive layer, allowing vapor to escape through multiple discrete locations rather than requiring a single long path through insulating layers. This segmentation of the escape route reduces the burden on any single path and prevents pressure buildup that would cause cracks or delamination.
Solution Approach 2:
The conductive layer with openings acts as an intermediary structure between the moisture-absorbing synthetic resin filler and the external environment. Instead of allowing vapor to travel directly through insulating layers (causing damage), the conductive layer provides an alternative intermediate pathway via its openings, mediating the vapor escape process safely.
2Object-generated harmful factors
If vapor escape path through insulating layers is used, then moisture release is achieved, but long travel path causes cracks and layer separation
Solution Approach 1:
The patent extracts the vapor escape function from the insulating layers by providing an alternative escape path through openings in the conductive layer. This removes the harmful long travel path requirement from the insulating layers, allowing them to focus on their primary insulating function without suffering from vapor-induced damage.
Solution Approach 2:
The patent changes the dimension of the vapor escape path by moving from a vertical path through multiple insulating layers to a more direct path through openings in the conductive layer. This dimensional change in the escape route significantly shortens the travel path and reduces exposure time to harmful vapor pressure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents cracks and layer separation by efficiently releasing moisture vapor, maintaining the integrity of the substrate and electronic components.
Implementation Method 1
moisture included in the synthetic resin filler is evaporated, and tries to escape to the outside... the vapor tries to escape to the outside from the end of each insulating layer closest to the core layer, travelling through the insulating layer
Data Source
AI summary
In a first conductive layer and a third conductive layer that are respectively closest to a core layer having a storage portion that penetrates therethrough, four first penetrating holes and four first penetrating holes are formed so as to overlap part of an opening edge of the storage portion that is projected onto the first conductive layer and the third conductive layer, respectively.