Ceramic Substrate Lamination for Recessed Portion Warpage Control
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Solution Overview
Problem
Ceramic substrates experience warpage due to uneven pressure distribution during the press process, leading to density variations between regions with and without recessed portions, which are not effectively addressed by existing manufacturing methods.
Innovation Solution
A method involving the lamination of ceramic green sheets on shrinkage suppressing green sheets with a lower planar shrinkage rate, forming a mother multilayer body and pressing recessed portions before firing, which allows for curvature of grain boundaries and increased plate-shaped ceramic filling members in the shrinkage suppressing layer to manage warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If pressure is applied to form recessed portions in ceramic green sheets, then recessed portions are successfully formed, but density distribution occurs and warpage happens after firing
Solution Approach 1:
The invention divides the ceramic substrate into multiple layers: a ceramic green sheet layer and a shrinkage suppressing green sheet layer. By segmenting the structure, the press process can form recessed portions in the ceramic green sheet without causing overall warpage, as the shrinkage suppressing layer compensates for density differences during firing.
Solution Approach 2:
The invention uses a composite structure combining ceramic green sheet and shrinkage suppressing green sheet. This composite approach allows the formation of recessed portions while the shrinkage suppressing layer counteracts warpage tendencies, resolving the contradiction between shape formation and warpage control.
2Ease of manufacture
If uniform pressure is applied during pressing, then manufacturing is simple, but recessed portions cannot be formed with required density distribution
Solution Approach 1:
By dividing the green sheet into ceramic and shrinkage suppressing layers, the pressing process can apply uniform pressure while still achieving the desired recessed portion formation. The segmentation allows different layers to respond differently to the same pressure, enabling shape formation without complex pressure control.
3Shape
If ceramic green sheet is pressed to form recessed portions, then mounting surfaces are created, but density variation occurs between pressed and non-pressed regions
Solution Approach 1:
The composite structure of ceramic green sheet and shrinkage suppressing green sheet allows mounting surfaces to be formed through pressing while the shrinkage suppressing layer maintains overall density stability during firing, compensating for variations introduced by the pressing process.
Solution Approach 2:
The invention changes the material composition parameter by introducing a shrinkage suppressing green sheet with different properties. This parameter change allows the system to accommodate density variations in the pressed regions while maintaining overall compositional stability during firing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively suppresses warpage in ceramic substrates by controlling shrinkage and density distribution during firing, ensuring a stable substrate structure.
Implementation Method 1
the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet
Implementation Method 2
forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet
Data Source
AI summary
A method for manufacturing a ceramic substrate that includes forming a mother multilayer body by laminating a ceramic green sheet on a shrinkage suppressing green sheet, the shrinkage suppressing green sheet having a planar shrinkage rate in firing smaller than a planar shrinkage rate in firing of the ceramic green sheet; and forming a recessed portion in the mother multilayer body before firing by pressing a recessed portion formation planned region where the recessed portion is to be formed after firing of the mother multilayer body.


