PCB Insulating Layer Through Cavity Design for Warpage Reduction
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Printed circuit boards face challenges in accommodating large-sized components and reducing warpage, particularly in high-performance and super-integrated electrical devices, where traditional designs may lead to instability and heat management issues.
Innovation Solution
A printed circuit board design featuring a first insulating layer with a through cavity and recesses at its edges, allowing for increased component size and type accommodation, improved heat release, and reduced warpage risk, achieved through a manufacturing process involving laser irradiation and particle collision to form the cavity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If large-sized components are coupled to the printed circuit board to implement high performance and super-integration, then component functionality and integration are improved, but warpage of the printed circuit board increases
Solution Approach 1:
The insulating layer is segmented by forming through cavities that extend through its thickness, creating separate regions that can independently accommodate components. This segmentation allows the structure to flex locally without causing overall board warpage, resolving the contradiction between component accommodation and board stability.
Solution Approach 2:
Recesses are formed at specific locations (edges of the through cavity) to provide localized stress relief and thermal expansion accommodation. This local quality modification allows the insulating layer to maintain overall structural integrity while adapting to local component requirements, preventing warpage while supporting large components.
2Ease of manufacture
If traditional printed circuit board designs are used, then manufacturing simplicity is maintained, but heat management capability deteriorates
Solution Approach 1:
The insulating layer incorporates through cavities that create a porous-like structure, enabling improved heat dissipation pathways. These cavities allow heat to escape through the insulating layer rather than being trapped, significantly improving heat management while maintaining compatibility with existing manufacturing processes like laser drilling and particle bombardment.
3Adaptability or versatility
If through cavities are formed in the insulating layer to accommodate components, then component size and type variety are increased, but manufacturing complexity increases
Solution Approach 1:
The formation of through cavities combines multiple functions into a single structural feature: component accommodation, heat dissipation, and stress relief. By merging these functions into the through cavity structure itself, the design achieves high adaptability without proportionally increasing manufacturing complexity, as the same cavity structure serves multiple purposes.
Solution Approach 2:
The through cavity structure serves multiple functions simultaneously: it accommodates various component sizes and types, provides thermal management pathways, and offers mechanical stress relief. This multi-functionality allows a single design feature to address multiple requirements, reducing the need for additional specialized structures and processes.
4Stability of the object's composition
If recesses are added to the insulating layer edges, then structural stability and warpage reduction are improved, but manufacturing precision requirements increase
Solution Approach 1:
The recesses are formed as a byproduct of the through cavity formation process itself, utilizing the same laser drilling and particle bombardment steps. The recesses emerge from the interaction of particles with the insulating layer edges during cavity formation, eliminating the need for separate precision machining operations and reducing overall manufacturing precision requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances component accommodation, heat release efficiency, and structural stability, reducing the likelihood of warpage while maintaining durability and reliability in forming the through cavity.
Implementation Method 1
forming a hole by irradiating a laser to a portion of a first insulating layer
Implementation Method 2
forming a through cavity by colliding a plurality of particles with a region including the hole of the first insulating layer
Data Source
AI summary
A printed circuit board includes a first insulating layer having a through cavity and containing an insulating material. A length between one side surface and the other side surface opposite to the one side surface of the through cavity is greater than a thickness of the first insulating layer, and the first insulating layer includes a recess located in each of an upper edge and a lower edge of the one side surface of the through cavity.