Component Carrier Ultra-Thin Transition Layer for Delamination Control

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Solution Overview

Problem

Component carriers face challenges in assembling components with high reliability due to poor adhesion and thermal mismatch between components and the carrier materials, leading to issues like warpage, delamination, and stress formation.

Innovation Solution

A laminated stack with a transition layer of 0.5 nm to 1 μm thickness, made of materials like Bis(2-methoxyethyl)ether and aromatic polyamideimide, is used to promote adhesion and thermal reliability between the component and the stack, effectively suppressing delamination and stress by acting as a mechanical and thermal buffer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If components are assembled on component carriers with high functionality and miniaturization, then product functionality and component density are improved, but heat removal becomes increasingly difficult and adhesion reliability deteriorates

Engineering Contradiction:

Improveproduct functionalityVSAvoidadhesion reliability

Core Design Contradiction:

Adaptability or versatilityVSReliability

Solution Approach 1:

A transition layer is introduced as an intermediary between the component and the laminated stack. This transition layer has a coefficient of thermal expansion that is intermediate between the component and the carrier materials, acting as a buffer to reduce stress and prevent delamination while maintaining assembly reliability under harsh conditions

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If transition layer thickness is increased to improve adhesion and thermal reliability, then mechanical and thermal reliability are improved, but component carrier thickness increases

Engineering Contradiction:

Improvethermal reliabilityVSAvoidcomponent carrier thickness

Core Design Contradiction:

ReliabilityVSLength of stationary object

Solution Approach 1:

The transition layer thickness is optimized to a specific range (0.5 nm to 1 μm) to achieve the desired balance. This parameter optimization ensures sufficient adhesion and stress buffering while maintaining a compact overall thickness of the component carrier

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If conventional materials are used without transition layer to maintain compact design, then manufacturing simplicity is maintained, but warpage and delamination occur under thermal stress

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidstructural stability

Core Design Contradiction:

Ease of manufactureVSStability of the object's composition

Solution Approach 1:

The transition layer serves as a stress-buffering intermediary that prevents warpage and delamination caused by thermal expansion mismatch between components and carrier materials, thereby improving structural stability without significantly complicating the manufacturing process

Inventive Principle:

Principle #24Intermediary (Mediator)

Data Source

PatentUS11963310B2Component carrier having component covered with ultra-thin transition layer

Publication Date: 2024.04.16 AT & S CHINA

AI summary

A method of manufacturing a component carrier includes providing a laminated stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, at least partially covering a component with a transition layer having a thickness in a range from 0.5 nm to 1 μm, and assembling the component with the stack.