Glass Core PCB Via Formation Using CMP and SAP
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Solution Overview
Problem
Conventional printed circuit boards using glass cores face challenges in forming fine line widths and are prone to damage during processing, with exposed glass surfaces being vulnerable to impacts and complex warpage control.
Innovation Solution
The solution involves forming a through-via on a glass layer using Chemical Mechanical Polishing (CMP) and Semi Additive Process (SAP), along with embedding and plugging processes, and using a reinforcing layer like Copper Clad Laminate (CCL) as a jig to simplify the process, prevent damage, and protect the glass layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a through-via is formed on a glass core using conventional methods, then the glass core can be processed, but the process becomes complicated and the glass core is prone to damage
Solution Approach 1:
The patent applies preliminary action by forming the through-hole in the glass core before laminating the copper clad laminate. This preliminary hole formation allows subsequent plugging and wiring processes to be simplified, as the structural integrity of the glass core is maintained during later manufacturing steps, reducing damage risk while enabling complex circuit patterns.
Solution Approach 2:
The patent uses an intermediary approach by introducing a plugging material to fill the through-hole, creating a stable intermediate structure. This plugged through-hole serves as a reliable foundation for subsequent wiring layer formation, simplifying the overall manufacturing process while protecting the glass core from damage during later processing steps.
2Manufacturing precision
If fine line width is implemented directly in the glass core, then microcircuit precision is improved, but the process complexity increases and manufacturing difficulty rises
Solution Approach 1:
The patent segments the circuit formation process into distinct stages: first forming the through-hole in the glass core, then adding wiring layers subsequently. This segmentation allows fine line widths to be achieved in the wiring layers without requiring complex direct glass core processing, thereby maintaining manufacturing precision while reducing process complexity.
Solution Approach 2:
The patent transitions from two-dimensional circuit patterns directly on the glass core to a three-dimensional structure with through-holes and stacked wiring layers. This dimensional change enables fine line widths to be achieved through vertical layering rather than direct horizontal patterning on the glass surface, simplifying the manufacturing process while maintaining precision.
3Device complexity
If the glass core surface is exposed in the finished product, then the structure remains simple, but the surface becomes vulnerable to impacts and environmental damage
Solution Approach 1:
The patent applies the principle of protective coverings by using the copper clad laminate and subsequent wiring layers as protective films over the glass core surface. These layers act as a shield against impacts and environmental damage while maintaining a relatively simple overall structure, as the protection is integrated into the functional circuit layers rather than added as separate protective elements.
4Ease of manufacture
If conventional glass core processing is used, then manufacturing is straightforward, but warpage control becomes difficult
Solution Approach 1:
The patent uses composite materials by combining the glass core with copper clad laminate and plugging materials. This composite structure allows better warpage control through the combined properties of the different materials, while the manufacturing remains straightforward as each layer is added through standard lamination and processing techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of microcircuits on glass layers with simplified processes, improved warpage control, and enhanced protection of the glass layer from damage and external impacts.
Implementation Method 1
a via metal layer disposed on a wall surface of the through-hole
Implementation Method 2
form a through-via on a glass layer and then flatten the through-via using Chemical Mechanical Polishing (CMP)
Data Source
AI summary
A printed circuit board includes: a glass layer having a through-hole penetrating between an upper surface and a lower surface thereof; a through-via including a via metal layer disposed on a wall surface of the through-hole and a first insulating material disposed in at least a portion of a space between portions of the via metal layer in the through-hole; a first wiring layer disposed on the upper surface of the glass layer, at least a portion of the first wiring layer connected to an upper side of the through-via; a second wiring layer disposed on the lower surface of the glass layer, at least a portion of the second wiring layer connected to a lower side of the through-via; and a second insulating material covering at least a portion of an external surface of the glass layer. The first and second insulating materials include substantially the same material.