Circuit Mounting Assembly with Thermally Conductive Dielectric Isolation
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Solution Overview
Problem
Conventional circuit mounting assemblies face challenges in providing effective heat dissipation, dielectric insulation, and vibration isolation, particularly in compact electronic modules subjected to high voltage and severe vibration environments.
Innovation Solution
A circuit mounting assembly comprising a circuit board, a chassis, and a thermally conductive dielectric material compressed between them by fasteners, which provides vibration isolation, electrical insulation, and thermal conduction through aligned fastener holes, bosses, and thermal posts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional mounting methods are used for compact electronic modules, then the structure is simple, but heat dissipation is insufficient
Solution Approach 1:
The patent combines multiple functions into a single integrated mounting structure: the bracket serves simultaneously as a mechanical support, a thermal conduction path, and an electrical isolation barrier. This merging of functions resolves the contradiction by achieving effective heat dissipation without proportionally increasing structural complexity
Solution Approach 2:
The patent employs composite material strategies by using thermally conductive dielectric materials that provide both thermal conduction and electrical insulation properties. This allows the mounting structure to achieve superior heat dissipation while maintaining electrical safety without requiring additional complex components
2Reliability
If dielectric insulation is added between circuits and chassis for high voltage, then electrical safety is improved, but thermal conduction is reduced
Solution Approach 1:
The patent uses thermally conductive dielectric materials that possess both electrical insulation and thermal conduction properties simultaneously. This composite material approach resolves the contradiction by providing electrical safety through dielectric insulation while maintaining effective thermal conduction pathways from circuits to chassis
Solution Approach 2:
The patent changes the material parameters by selecting dielectric materials with high thermal conductivity values, thereby improving thermal conduction performance while maintaining electrical insulation properties. This parameter optimization resolves the trade-off between electrical safety and heat dissipation
3Reliability
If more fastener mounting points are added for severe vibration environments, then vibration resistance is improved, but device complexity increases
Solution Approach 1:
The patent merges vibration resistance functionality into the existing mounting bracket structure rather than adding separate vibration isolation components. The bracket design incorporates vibration attenuation features while serving its primary support function, thereby improving vibration resistance without proportionally increasing structural complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The assembly effectively dissipates heat, isolates electrical components, and reduces vibration, ensuring reliable operation in harsh environments by combining thermal conduction, electrical insulation, and vibration damping.
Implementation Method 1
provide thermal conduction between the chassis and the circuit board
Implementation Method 2
provide vibration isolation and electrical isolation between the chassis and the circuit board
Implementation Method 3
provide vibration isolation and electrical isolation between the chassis and the circuit board
Data Source
Figure 1
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AI summary
A circuit mounting assembly can include a circuit board (101), a chassis (103), a sheet of thermally conductive dielectric material, and one or more fasteners configured to compress the sheet between the circuit board (101) and the chassis (103) to provide vibration isolation and electrical isolation between the chassis (103) and the circuit board (101), and to provide thermal conduction between the chassis (103) and the circuit board (101).