Laminated Substrate Via Layout for Thermal Expansion Stress Relief

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Solution Overview

Problem

Existing laminated substrates face issues with long-term reliability due to stress applied to conductive paste during thermocompression bonding, which is caused by thermal expansion of resin in through holes, inhibiting effective electrical coupling between multilayer substrates.

Innovation Solution

The laminated substrate design includes conductive paste vias positioned differently from through holes, with bonding lands configured to minimize stress and thermal expansion effects, and incorporates insulating adhesive layers to maintain flatness and electrical coupling integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the conductive paste is positioned directly above the through hole for electrical coupling, then the electrical connection is direct and efficient, but stress is applied to the conductive paste due to thermal expansion of resin during thermocompression bonding, reducing long-term reliability

Engineering Contradiction:

Improvelong-term reliability of conductive pasteVSAvoidstress on conductive paste from resin thermal expansion

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The conductive paste via is positioned at a location different from the through hole, transitioning from a direct vertical alignment to an offset arrangement. This spatial repositioning in the planar dimension allows the conductive paste to be electrically connected to the through hole via bonding lands while avoiding the stress concentration zone caused by resin thermal expansion.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

Bonding lands serve as intermediary conductive structures that bridge the electrical connection between the through hole and the conductive paste via. This intermediary arrangement allows electrical coupling without direct positioning of the conductive paste above the through hole, thereby eliminating stress exposure while maintaining electrical functionality.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If multiple conductive paste vias are arranged around the through hole, then heat generation and noise interference are reduced, but the structural complexity increases

Engineering Contradiction:

Improveheat generation and noise interferenceVSAvoidarrangement complexity of conductive paste vias

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The single direct electrical connection path is segmented into multiple paths by arranging multiple conductive paste vias around the through hole. Each via provides an independent electrical connection route through bonding lands, distributing the electrical current and reducing heat concentration while minimizing noise interference through spatial separation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures long-term reliability and reduces heat generation and noise interference, preventing resistance abnormalities and ensuring stable electrical connections.

Implementation Method 1

stress is applied to the conductive paste due to the thermal expansion of resin when the multilayer substrates are bonded to each other with thermocompression bonding

Methodology Applied

Scientific EffectThermal expansion: Thermal Expansion

Implementation Method 2

a conductive paste via configured to electrically couple the bonding lands of the multilayer substrates opposed to each other

Methodology Applied

Scientific EffectElectrical conduction: Conduction (electrical)

Implementation Method 3

an insulating adhesive layer and a conductive paste via disposed between the multilayer substrates

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS20250374420A1Laminated substrate and method of manufacturing laminated substrate

Publication Date: 2025.12.04 FM HOLDINGS CO LTD

AI summary

A laminated substrate includes multilayer substrates stacked, wherein the multilayer substrates are each provided with a through hole which penetrates the multilayer substrates, an inner wall surface of which is plated, and which is filled with resin, and bonding lands formed on upper and lower surfaces of the through hole and electrically coupled to the through hole, an insulating adhesive layer and a conductive paste via for electrically coupling the bonding lands of the multilayer substrates opposed to each other with a conductive paste with which a through hole formed in the insulating adhesive layer is filled are disposed between the multilayer substrates, and the conductive paste via is disposed at a position different from a position at which the through hole is formed.