Redistribution Layer Stress Relief for Electronic Package Warpage
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Solution Overview
Problem
During the redistribution layer process in packaging technology, stress between circuit layers and isolation layers leads to warpage, causing misalignment and poor package devices.
Innovation Solution
Incorporating a de-warpage layer between circuit and isolation layers with varying thicknesses to mitigate stress and balance internal stresses, thereby reducing warpage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a redistribution layer process is performed with multiple circuit layers and isolation layers, then electrical connectivity is improved, but stress between layers causes warpage and misalignment
Solution Approach 1:
A de-warpage layer is introduced as an intermediary between the circuit layer and isolation layer. This intermediate layer has specific material properties (different thermal expansion coefficient) that mediate the stress between the two layers, preventing direct stress transmission and causing warpage while maintaining electrical connectivity through the redistribution layer structure
Solution Approach 2:
The de-warpage layer utilizes materials with different thermal expansion coefficients compared to the circuit layer and isolation layer. By changing the thermal expansion parameter of the intermediate layer, the stress distribution during temperature variations is modified, reducing warpage and improving alignment while preserving the electrical connectivity function
2Stability of the object's composition
If the thickness of isolation layers is uniformly increased to reduce stress, then structural stability is improved, but warpage is exacerbated due to uneven stress distribution
Solution Approach 1:
Instead of uniformly increasing the thickness of isolation layers, the patent introduces a de-warpage layer with specific local properties between the circuit layer and isolation layer. This local quality approach targets the stress concentration areas specifically, improving structural stability where needed without causing overall warpage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The de-warpage layer effectively reduces warpage and improves alignment of circuit and isolation layers, resulting in higher quality package devices.
Implementation Method 1
In packaging technology, plural package devices may be fabricated by performing a redistribution layer process on a carrier. During fabricating the redistribution layer, plural circuit layers and plural isolation layers are alternately formed. However, since stress is generated between one of the circuit layers and one of the isolation layers adjacent to each other, the formed circuit layers and the formed isolation layers may warp.
Data Source
AI summary
An electronic device is provided and includes a carrier and a redistribution layer. The carrier includes an electronic component and an encapsulation structure surrounding the electronic component. The redistribution unit is disposed on the carrier and electrically connected with the electronic component. The redistribution unit includes a first isolation layer and a second isolation layer, in which the second isolation layer is farther from the electronic component than the first isolation layer, and a thickness of the first isolation layer is greater than a thickness of the second isolation layer.