PCB Resin Composition for Warpage Control and Heat Resistance
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Solution Overview
Problem
Existing technologies fail to sufficiently reduce the warpage of printed wiring boards, particularly in thin multilayer coreless substrates, while maintaining sufficient stiffness, heat resistance, and handling properties.
Innovation Solution
A resin composition with specific physical property parameters, including storage moduli and glass transition temperature ranges, is used to cure a prepreg, which reduces warpage and enhances stiffness and heat resistance in printed wiring boards.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional resin compositions are used to maintain stiffness and heat resistance, then structural integrity is preserved, but warpage of printed wiring boards cannot be sufficiently reduced
Solution Approach 1:
The invention changes the physical and chemical parameters of the resin composition, specifically controlling the storage modulus at different temperatures (E'25°C = 3.0 to 15.0 GPa, E'260°C = 0.5 to 2.0 GPa) and glass transition temperature (Tg = 180°C to 240°C). These parameter changes allow the resin to provide sufficient stiffness during manufacturing while enabling warpage reduction through controlled viscous behavior at elevated temperatures.
Solution Approach 2:
The invention uses composite resin compositions containing multiple components including epoxy compounds, phenolic compounds, cyanate compounds, and inorganic fillers. This composite approach allows optimization of both stiffness and warpage control properties that cannot be achieved with single-material systems.
2Strength
If resin compositions with high filler content are used to increase stiffness, then structural strength is improved, but handling properties during manufacturing deteriorate
Solution Approach 1:
The invention creates a dynamic resin system where the storage modulus changes with temperature. At room temperature (25°C), the resin maintains high stiffness (E' ≥ 3.0 GPa) for structural integrity, while at processing temperatures (260°C), the modulus decreases significantly (E' ≤ 2.0 GPa) to provide viscous behavior that improves handling and conformability during manufacturing processes.
3Temperature
If the glass transition temperature is increased to improve heat resistance, then thermal stability is enhanced, but the resin becomes too rigid and warpage suppression capability is reduced
Solution Approach 1:
The invention performs preliminary action by controlling the resin's viscous behavior at temperatures above the glass transition point (Tg + 50°C to Tg + 100°C) during the manufacturing process. This allows warpage suppression to occur during lamination and curing before the final product cools to its service temperature, ensuring both heat resistance and dimensional stability are achieved.
Data Source
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AI summary
A resin composition comprising at least an organic resin, wherein physical property parameters specified by a storage modulus at a predetermined temperature and a glass transition temperature satisfy their respective predetermined ranges.