Camera Module Reinforcing Plate Heat Dissipation
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Solution Overview
Problem
Conventional camera devices face issues with heat dissipation, warpage due to thermal expansion differences, and increased height due to reinforcing plates and holders, which affect performance and reliability.
Innovation Solution
A camera module design featuring a reinforcing plate with increased thickness for improved heat dissipation, a circuit board with cavities to reduce connection member height, and a passive device placement to minimize module thickness, while preventing heat transfer to the lens.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of stationary object
If the image sensor is directly mounted on the printed circuit board, then the device height is reduced, but heat dissipation performance deteriorates
Solution Approach 1:
The patent introduces a reinforcing plate positioned between the printed circuit board and the image sensor, creating a new spatial dimension for heat dissipation. This plate provides a thermal conduction path from the image sensor bottom surface toward the PCB, enabling heat to be dissipated in a direction perpendicular to the sensor's imaging surface without increasing the overall device height in the optical axis direction.
2Temperature
If a reinforcing plate is added for heat dissipation, then heat dissipation performance improves, but device height increases
Solution Approach 1:
The reinforcing plate is positioned locally between the image sensor and the printed circuit board, providing heat dissipation functionality only where needed at the sensor mounting location. This localized approach allows heat dissipation without adding height to the entire device, as the plate integrates into the existing sensor mounting structure rather than adding a separate external component.
3Temperature
If epoxy is used to bond the image sensor on the reinforcing plate, then heat dissipation improves, but warpage occurs due to thermal expansion differences
Solution Approach 1:
The patent employs a bonding structure that combines the reinforcing plate with the printed circuit board to form a composite assembly. This composite structure integrates multiple materials (PCB, reinforcing plate, and bonding agent) that work together to manage thermal expansion differences, reducing warpage while maintaining heat dissipation functionality through the reinforcing plate.
4Ease of operation
If the driver device is placed on the circuit board, then control functionality is achieved, but heat generated from the driver device transfers to the lens and deteriorates performance
Solution Approach 1:
The driver device is extracted from its conventional position on the circuit board and relocated to the reinforcing plate. This separation removes the heat-generating driver device from proximity to the lens, preventing thermal interference with optical performance while maintaining its control functionality through electrical connections to the circuit board.
5Temperature
If a cavity-type circuit board is used with a reinforcing plate, then heat dissipation from the image sensor improves, but warpage occurs in a shape like '∩' during thermal curing
Solution Approach 1:
The reinforcing plate serves multiple functions simultaneously: it provides heat dissipation pathways for the image sensor, acts as a mounting substrate for the driver device, and functions as a structural support element during the curing process. This multi-functionality allows the same component to address heat dissipation while its structural role helps mitigate warpage during thermal curing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation for both the image sensor and driver device, reduces warpage, and minimizes the overall height of the camera module, thereby improving performance and reliability.
Implementation Method 1
a reinforcing plate; an image sensor disposed on the reinforcing plate
Implementation Method 2
a circuit board disposed on the reinforcing plate and including a cavity overlapping the image sensor and the driver device in a vertical direction
Data Source
AI summary
A camera module according to an embodiment includes a reinforcing plate; an image sensor disposed on the reinforcing plate; a driver device disposed on the reinforcing plate and spaced apart from the image sensor in a horizontal direction; and a circuit board disposed on the reinforcing plate and including a cavity overlapping the image sensor and the driver device in a vertical direction, wherein the circuit board includes a first pad and a second pad, wherein the image sensor is connected to the first pad in the cavity, and wherein the driver device is connected to the second pad in the cavity.