Optical Communication Module Substrate with Segmented Reinforcement
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Solution Overview
Problem
Existing optical communication module substrates face challenges in maintaining mechanical strength while ensuring excellent electrical properties at connection points, particularly for high-frequency and fine-pitch wiring, leading to reduced signal transmission efficiency.
Innovation Solution
The optical communication module substrate features a frame-shaped removal portion in the metal reinforcing layer surrounding the connection terminals, ensuring mechanical strength and minimizing electrical interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a portion of the metal reinforcing layer is removed to reduce static capacitance and improve impedance matching, then electrical properties at connection points are improved, but mechanical strength at the connection points is reduced
Solution Approach 1:
The metal reinforcing layer is segmented by removing only the portion that directly overlaps with the connection terminal, while leaving the surrounding metal reinforcing layer intact. This segmentation approach removes the harmful static capacitance component while preserving the mechanical strength provided by the remaining metal structure.
Solution Approach 2:
The invention applies local quality by creating a non-uniform metal reinforcing layer structure - the portion overlapping the connection terminal is removed to improve electrical properties, while the surrounding portions are retained to maintain mechanical strength. This localized modification optimizes both electrical and mechanical properties in different regions.
2Strength
If the metal reinforcing layer is made continuous to ensure mechanical strength, then connection strength is improved, but impedance mismatch increases due to static capacitance
Solution Approach 1:
The continuous metal reinforcing layer is segmented by removing the portion overlapping the connection terminal. This segmentation eliminates the static capacitance between the metal layer and terminal while maintaining the structural integrity of the remaining metal portions for mechanical strength.
Solution Approach 2:
The harmful portion of the metal reinforcing layer that causes static capacitance is extracted (removed) from the structure. Only the specific portion overlapping the connection terminal is removed, while the rest of the metal reinforcing layer is retained to provide mechanical support.
Data Source
AI summary
An optical communication module substrate includes a wiring board and an opto-electronic hybrid substrate, the wiring board and the opto-electronic hybrid substrate being connected to each other, in which a connection terminal of the wiring board and a connection terminal of the opto-electronic hybrid substrate are electrical connection points, and a frame-shaped removal portion is formed by removing a portion of the metal reinforcing layer of the opto-electronic hybrid substrate that faces the connection terminal with the insulating layer interposed between the metal reinforcing layer and the connection terminal, so as to surround each terminal. According to this configuration, the connection strength at the connection point between the wiring board and the opto-electronic hybrid substrate is sufficiently ensured, and the optical communication module substrate has excellent electrical properties that are compatible with high-speed signal transmission.