Stress Detection Pattern on Memory Module Board
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Solution Overview
Problem
Memory modules, such as solid state drives, face challenges in detecting and predicting stress levels applied externally, which can lead to failures like cracking or disconnection of wiring or solder joints, making it difficult to identify defective sites and quantify the stress exerted.
Innovation Solution
Incorporating a stress detection pattern on the module board with strips of varying widths and directional orientations, connected via structures, and pad structures to indicate stress levels through visual or electrical signals, allowing for the determination and prediction of external force direction and magnitude.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If stress detection patterns are added to the module board, then the ability to detect and predict stress levels is improved, but the device complexity increases
Solution Approach 1:
The stress detection pattern utilizes width changes of conductive strips as visual indicators of stress levels. Different stress conditions cause different degrees of strip width variation, enabling detection through visual inspection or electrical measurement of the strip dimensions.
Solution Approach 2:
The stress detection pattern creates a simplified model of the actual stress conditions by using conductive strips that replicate the deformation behavior of the module board under stress, allowing indirect measurement of stress levels through the strip geometry changes.
2Measurement precision
If multiple strips with different widths are used to indicate stress levels, then the measurement precision of stress levels is improved, but the manufacturing precision requirements increase
Solution Approach 1:
The conductive strips are pre-designed with specific width variations during the manufacturing process to correspond to predetermined stress levels. This preliminary configuration allows the strips to directly indicate stress levels without requiring complex real-time calibration or adjustment.
3Measurement precision
If stress detection patterns are positioned between electronic elements, then the ability to detect stress at critical locations is improved, but the ease of manufacture decreases
Solution Approach 1:
The stress detection pattern is integrated into the module board structure itself, with conductive strips formed as part of the board's conductive layers. This merging eliminates the need for separate stress detection components and simplifies the manufacturing process by incorporating detection functionality into the existing board fabrication process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise detection and prediction of stress levels applied to memory modules, helping to identify potential failures and inform design improvements based on analysis data from multiple modules.
Implementation Method 1
a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board
Data Source
AI summary
A memory module includes a module board extending in one direction, a plurality of electronic elements mounted on the module board, and at least one stress detection pattern in a position between the electronic elements or adjacent to one or more of the electronic elements on the module board and including a plurality of strips configured to indicate a stress level generated in the position by an external force applied to the module board.