Decoupling Layer Structure for Electronic Package Warpage Reduction
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Solution Overview
Problem
Electronic packages face spatial instability due to thermal-induced mechanical stress caused by differences in Coefficient of Thermal Expansion (CTE) between printed circuit board materials and semiconductor materials, leading to warpage, which reduces operational reliability, especially in high-heat applications.
Innovation Solution
An electronic package design incorporating a decoupling material with a Young Modulus smaller than 1 GPa, which absorbs and compensates mechanical stress through appropriate deformation, reducing warpage by decoupling portions of the package and mitigating stress on electric connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a component is embedded within the component carrier to achieve further integration and miniaturization, then integration density is improved, but thermal-induced mechanical stress increases causing warpage
Solution Approach 1:
The patent introduces a decoupling material as an intermediary substance between the embedded component and the component carrier. This decoupling material has a Young's Modulus of less than 1 GPa, which allows it to act as a stress-absorbing buffer that mechanically decouples the component from the carrier, thereby reducing warpage while maintaining the embedded configuration for high integration density.
Solution Approach 2:
The patent changes the mechanical parameter (Young's Modulus) of the material used in the decoupling layer to be less than 1 GPa. This parameter change enables the material to deform elastically under thermal stress, absorbing the mechanical stress generated by CTE differences between the component and carrier, thus reducing warpage while preserving the embedded component structure.
2Ease of manufacture
If printed circuit board materials with certain CTE are used, then manufacturing ease is improved, but thermal-induced mechanical stress increases due to CTE mismatch with semiconductor materials
Solution Approach 1:
The decoupling material serves as a mediator between the PCB material and the semiconductor component. It absorbs the mechanical stress arising from CTE mismatch, allowing the use of conventional PCB materials that are easy to manufacture with, while preventing stress transmission to the embedded component that would cause warpage.
Solution Approach 2:
The patent changes the mechanical property parameter (Young's Modulus) of the decoupling material to be less than 1 GPa, which is significantly lower than conventional PCB materials. This parameter change enables the material to deform and absorb thermal stress, reducing the mechanical stress transmitted between components with different CTE values.
3Strength
If conventional decoupling materials with higher Young Modulus are used, then structural strength is improved, but stress absorption capability decreases leading to increased warpage
Solution Approach 1:
The patent inverts the conventional approach by changing the Young's Modulus parameter to be very low (less than 1 GPa) for the decoupling material. This counterintuitive parameter change allows the material to deform elastically and absorb thermal stress, improving reliability by reducing warpage, while the overall structural strength is maintained through the layer stack configuration and base structure.
Solution Approach 2:
The patent applies local quality by using a decoupling material with specific low Young's Modulus properties only in the decoupling layer, while other layers in the stack can have different material properties. This localized application of soft, stress-absorbing material where needed (between component and carrier) allows stress absorption without compromising the overall structural integrity of the package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The use of a decoupling material with a low Young Modulus effectively reduces warpage, enhancing operational reliability and stability, even under high heat conditions, by absorbing and compensating mechanical stress, thus addressing the challenge of spatial instability in electronic packages.
Implementation Method 1
the decoupling material having a Young Modulus being smaller than 1 GPa... which absorbs and compensates mechanical stress through appropriate deformation
Implementation Method 2
thermal induced mechanical stress may be caused by a difference in the Coefficient of Thermal Expansion (CTE) of (i) printed circuit board materials... and (ii) semiconductor materials... of the embedded component
Data Source
AI summary
An electronic package having a base structure; a layer stack formed over the base structure; and a component embedded at least partially within the base structure and/or within the layer stack. The layer stack has a decoupling layer structure, the decoupling layer structure with a decoupling material having a Young Modulus being smaller than 1 GPa.