Multilayer Resin Substrate With Direct-Bonded Rigid Mounting Portions
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Solution Overview
Problem
Existing multilayer resin substrates face challenges in ensuring adhesion between different layers and preventing deformation and cracking at the boundary between rigid and flexible portions.
Innovation Solution
The multilayer resin substrate is designed with identical crystalline thermoplastic resin layers for the multilayer substrate portion and the mounting portion, ensuring high adhesion. The mounting portion undergoes a temperature raising/lowering process to increase crystallinity and elastic modulus, while the substrate portion has a lower elastic modulus, reducing deformation and stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If different materials are used for the multilayer substrate and mounted components, then material selection flexibility is improved, but adhesion between layers deteriorates
Solution Approach 1:
The patent applies homogeneity by using the same crystalline thermoplastic resin material for both the multilayer substrate and the mounted components. This ensures that the resin layers have identical chemical composition and physical properties, creating strong adhesion through direct bonding without requiring special adhesive layers or surface treatments. The homogeneous material composition allows the layers to bond naturally at the molecular level.
2Stability of the object's composition
If the multilayer substrate is made rigid to prevent deformation, then structural stability is improved, but stress concentration at boundaries worsens
Solution Approach 1:
The patent applies local quality by creating a rigid mounted portion through heat treatment while keeping the multilayer substrate portion relatively flexible. The mounted portion undergoes crystallization treatment to increase its elastic modulus and rigidity, while the substrate maintains its original properties. This localized differentiation allows the mounted portion to be rigid for stability while the substrate remains flexible to absorb stress and prevent cracking at boundaries.
Solution Approach 2:
The patent applies parameter changes by modifying the crystallinity and elastic modulus of the mounted portion through heat treatment. By controlling the temperature and duration of heating, the crystallinity of the mounted portion is increased, which changes its mechanical properties from flexible to rigid. This parameter change allows the same material to exhibit different mechanical behaviors in different regions, achieving both stability and stress relief.
3Adaptability or versatility
If the number of laminated insulator layers is increased to provide thicker regions, then functional capacity is improved, but adhesion and structural integrity worsen
Solution Approach 1:
The patent applies homogeneity by ensuring that all resin layers, including those with different thicknesses, are made of the same crystalline thermoplastic resin material. This homogeneous material composition ensures that each layer bonds strongly to its neighbors through direct bonding, maintaining adhesion and structural integrity even when the number of layers and total thickness vary to accommodate different functional requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design ensures strong adhesion between the substrate and mounting portions, suppresses deformation of rigid portions, and prevents cracking at the boundary between flexible and rigid regions, enhancing the structural integrity and performance of the multilayer resin substrate.
Implementation Method 1
the resin layers of the multilayer substrate portion and the resin layer of the mounting portion have a difference in endothermic peak temperature that appears first during temperature raising in a 1st-up chart when differential scanning calorimetry is performed at a temperature raising rate of 10° C./min
Implementation Method 2
both the resin layers of the multilayer substrate portion and the resin layer of the mounting portion are layers made of, as a first component, a crystalline thermoplastic resin
Data Source
AI summary
A multilayer resin substrate includes a multilayer substrate portion and a mounting portion, both a resin layer of the multilayer substrate portion and a resin layer of the mounting portion are layers made of, as a first component, a crystalline thermoplastic resin that is identical, the resin layer of the multilayer substrate portion and the resin layer of the mounting portion have a difference in endothermic peak temperature that appears first during temperature raising in a 1st-up chart when differential scanning calorimetry (DSC) is performed at a temperature raising rate of 10° C./min, the endothermic peak temperature of the resin layer of the multilayer substrate portion is lower as compared to the endothermic peak temperature of the resin layer of the mounting portion, and the resin layer of the multilayer substrate portion and the resin layer of the mounting portion are directly bonded to each other.