Radiation Imaging Sensor Thermal Isolation via Segmented Partition
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Solution Overview
Problem
The existing radiation imaging apparatus suffers from deterioration in image quality due to uneven heat effects on sensor boards caused by electrical components housed in the same casing, leading to instability in image quality.
Innovation Solution
Incorporation of a heat insulation member with lower thermal conductivity than the base, positioned between the electrical components and the sensor unit, to reduce direct heat transfer and convection, thereby isolating the sensor boards from heat produced by electrical components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If electrical components are housed in the same casing as sensor boards, then device integration is improved, but image quality stability deteriorates due to uneven heat effects on sensor boards
Solution Approach 1:
The interior space of the casing is segmented into a first space for electrical components and a second space for sensor boards, physically separating the heat-generating components from the temperature-sensitive components to prevent heat-induced image quality degradation while maintaining integration
Solution Approach 2:
A partition wall is introduced as an intermediary structure between electrical components and sensor boards, acting as a thermal barrier that allows both components to coexist in the same casing while preventing direct heat transfer that would compromise sensor board performance
2Volume of moving object
If sensor boards are stacked together in a single layer, then device compactness is improved, but temperature uniformity deteriorates causing differential heat effects
Solution Approach 1:
The stacked sensor boards are segmented into different spatial zones within the casing, with each sensor board positioned in the second space at different locations, allowing compact stacking while maintaining uniform temperature distribution through strategic spatial arrangement
Solution Approach 2:
The partition wall and spatial arrangement create equipotential thermal conditions for all sensor boards in the stack, ensuring that heat from electrical components affects all sensor boards uniformly rather than creating temperature gradients that would cause differential thermal effects
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution stabilizes image quality by minimizing the temperature difference between the sensor boards, enhancing the signal-to-noise ratio and overall image quality by suppressing heat transfer from electrical components to the sensor unit.
Implementation Method 1
a heat insulation member including a portion located between the electrical component and the sensor unit, wherein a heat conductivity of the heat insulation member is lower than a heat conductivity of the base
Data Source
AI summary
A radiation imaging apparatus comprises a sensor unit including two sensor boards stacked together, a base supporting the sensor unit, an electrical component on an opposite side to the sensor unit relative to the base, and a heat insulation member including a portion located between the electrical component and the sensor unit. A heat conductivity of the heat insulation member is lower than a heat conductivity of the base.