Built-In Lead Capacitor Structure for Low-Profile Surface Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing capacitors face challenges in miniaturization due to exposed guide pins, which increase thickness and reduce reliability when used as surface mount components.
Innovation Solution
A miniaturized capacitor design with built-in conductive leads, where the substrate is integrated with conductive members and leads, eliminating the need for external rubber plugs and plastic plates, and allowing for a reduced height and size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If guide pins are exposed on the capacitor surface for connection, then electrical connection is achieved, but the capacitor thickness increases and reliability decreases
Solution Approach 1:
The patent merges the guide pin function with the capacitor terminal by integrating the conductive lead directly into the sealing structure. The conductive lead passes through the sealing ring and is crimped to the terminal, eliminating the need for separate exposed guide pins while maintaining electrical connection functionality.
Solution Approach 2:
The conductive lead is nested within the sealing ring structure, with the lead passing through the sealing ring and being crimped inside the terminal. This nesting approach hides the conductive connection path within the capacitor body, reducing external exposure and thickness.
2Ease of operation
If guide pins are exposed on the capacitor surface, then electrical connection is achieved, but additional structures (plastic plate, rubber plugs) are required increasing complexity
Solution Approach 1:
The patent combines multiple functions into the sealing ring: sealing, conductive lead guidance, and mechanical support. The conductive lead integrates the electrical connection function directly through the sealing structure, eliminating the need for separate plastic plates and rubber plugs.
Solution Approach 2:
The sealing ring serves multiple functions: providing sealing, guiding the conductive lead, supporting the terminal, and enabling electrical connection. This multi-functionality reduces the number of separate components needed in the capacitor structure.
3Adaptability or versatility
If the capacitor is prepared as surface mount component with exposed guide pins, then mounting is enabled, but the guide pins are crushed and bent reducing reliability
Solution Approach 1:
The conductive lead is pre-crimped to the terminal and sealed within the sealing ring before the capacitor is mounted on the circuit board. This preliminary securing prevents the lead from being crushed or bent during the surface mounting process, maintaining structural integrity.
Solution Approach 2:
The conductive lead is nested within the sealing ring and terminal structure, protected from external mechanical stresses during mounting. This nested configuration shields the fragile lead from crushing and bending forces that would occur with exposed guide pins.
Data Source
AI summary
A miniaturized capacitor having built-in conductive leads includes a substrate, a main capacitor body, a plurality of conductive members and a plurality of conductive leads. The main capacitor body, disposed on the substrate, includes a capacitor unit and a packaging structure wrapping the capacitor unit. Each of the plurality of conductive members penetrates through the substrate, each of the plurality of conductive leads penetrates through the packaging structure, and the capacitor unit is connected with the plurality of conductive members via the plurality of conductive leads.