An exposed bus bar terminal spaced from the exterior body simplifies welding, improves connection stability, and helps dissipate heat.
An external switch on a deformable capacitor can bottom detects overpressure without internal sensors, avoiding impedance issues and added cost.
Integrated case-mounted terminals simplify surface-mount assembly, adapt to ceramic size changes, and reduce terminal resistance.
Undercut metal protrusions on multilayer ceramic terminals improve adhesion to exterior material, preventing peeling and vapor ingress.
Undercut metal protrusions on plated terminals lock into the exterior material to suppress peeling, vapor ingress, and reliability loss.
A segmented dielectric shell and layer keep the sensor chip over 400 µm from the busbar to prevent air breakdowns and short circuits.
A water-repellent interlayer blocks plating solution intrusion in a porous metal capacitor, reducing blister stress, cracking, and short circuits.
A clay labyrinth layer paired with a water absorbing layer blocks moisture in capacitors while keeping the barrier thin and compact.
End-surface shell members and a lighter side film block moisture ingress while reducing capacitor protection weight.
A widened, chamfered guide groove protects lead-out terminals during capacitor insertion while maintaining element positioning and insulation.
Built-in conductive leads replace exposed guide pins, cutting capacitor height while improving surface-mount stability and lead protection.
Gallium in the dielectric and side margins suppresses interface pores in multilayer ceramic capacitors, improving moisture resistance and breakdown reliability.
An internal rib and direct-fixing bus bar reinforce a low-height capacitor case, improving stiffness, positioning, and heat dissipation.
Multiple parallel winding elements and optimized terminals cut ESR and ESL in film capacitors for high-frequency power applications.
A staged process using oxidation, composite paste, light curing, and heat curing enables smaller passive components with easier manufacturing and longer life.
A cantilever engagement structure lets a capacitor box slide into and out of a rack without screws, cutting installation time and complexity.
Segmented protrusions create communication spaces that let sealing resin fill partitioned chip capacitor recesses evenly without overflow.
A blanket dopant implant raises conductivity in polysilicon bridges and contact regions, cutting trench capacitor ESR without extra masks.
A metal-plastic capacitor case improves heat dissipation while preserving insulation, lowering weight and cost, and enabling direct contact with IGBT cooling units.
Direct thermoplastic overmolding replaces bulky capacitor packaging, cutting volume while protecting leads and maintaining electrical performance.
A higher-filler resin layer near the case opening blocks moisture ingress while using the same base resin to keep film capacitor production simpler.
Resin seals bus bar openings in a metal laminate film exterior, preventing moisture ingress and electrical insulation breakdown.
An elastic seat clamps the capacitor while an insulating film decouples electrical potentials for reliable thermal management.
A capacitor casing filled with insulating fluid uses a volume compensation unit to balance internal and external pressures.