Multilayer Ceramic Capacitor Structure With Ga to Suppress Interface Pores
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Solution Overview
Problem
Multilayer ceramic capacitors face issues with moisture permeation and electrical field concentration due to pores at the interface between the body and side margin portions, leading to reduced breakdown voltage and moisture resistance reliability.
Innovation Solution
Incorporating gallium (Ga) into the dielectric microstructure of the capacitance forming portion, side margin portions, and cover portions to suppress pore formation and improve sintering compaction, thereby enhancing moisture resistance and electrical characteristics.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If a ceramic green sheet for a side margin portion is separately attached to maximize electrode area, then capacitance per unit volume is improved, but pores are generated at the interface joint portion causing moisture permeation and reduced reliability
Solution Approach 1:
The patent merges the body and side margin portion into a single integrated ceramic structure formed from a green sheet, eliminating the separate attachment process. This integration removes the interface joint portion where pores would form, thereby preventing moisture permeation pathways while maintaining the desired capacitance per unit volume through optimized electrode layout within the unified structure.
Solution Approach 2:
The patent extracts and eliminates the problematic interface joint portion by avoiding separate attachment of the side margin portion. By removing this vulnerable interface where pores form during conventional separate attachment, the invention prevents the generation of moisture permeation pathways while still achieving the necessary electrode area for high capacitance.
2Reliability
If sintering temperature is reduced to prevent pore formation, then moisture resistance reliability is improved, but sintering compaction deteriorates
Solution Approach 1:
The patent changes the chemical composition parameters of the ceramic material by incorporating specific oxide additives (such as B2O3, SiO2, Al2O3) in controlled amounts. These compositional parameter changes modify the sintering behavior to enable effective pore elimination and grain boundary sealing at lower sintering temperatures (1000-1200°C), thereby achieving both good compaction and moisture resistance without requiring high temperatures that would cause excessive pore formation.
3Quantity of substance
If internal electrode is exposed in width direction to maximize effective area, then capacitance is improved, but interface joint portion becomes vulnerable to moisture and plating solution permeation
Solution Approach 1:
The patent merges the body and side margin portion into a single integrated structure with continuous ceramic material, eliminating the interface joint portion that would otherwise be vulnerable to permeation. This allows the internal electrode to be fully exposed in the width direction for maximum effective area while the unified ceramic structure provides continuous protection against moisture and plating solution ingress throughout the entire component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The addition of gallium reduces pore formation, improves moisture resistance reliability, and enhances electrical characteristics by alleviating electrical field concentration, even during low-temperature sintering.
Implementation Method 1
Incorporating gallium (Ga) into the dielectric microstructure of the capacitance forming portion, side margin portions, and cover portions to suppress pore formation and improve sintering compaction
Implementation Method 2
The addition of gallium reduces pore formation, improves moisture resistance reliability, and enhances electrical characteristics by alleviating electrical field concentration, even during low-temperature sintering
Data Source
AI summary
A multilayer electronic component includes a body including a capacitance forming portion including a dielectric layer and an internal electrode alternately disposed in a first direction, and cover portions disposed on both end surfaces of the capacitance forming portion in the first direction, respectively, and including a first surface and a second surface opposing each other in the first direction, a third surface and a fourth surface opposing each other in a second direction, and a fifth surface and a sixth surface opposing each other in a third direction; external electrodes disposed on the third and fourth surfaces of the body, respectively; and side margin portions disposed on the fifth and sixth surfaces of the body, respectively. At least one of the capacitance forming portion, the cover portion, or the side margin portions includes a secondary phase including gallium (Ga).