Busbar Magnetic Sensor Isolation Structure Against Air Breakdown
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Solution Overview
Problem
Existing sensor devices face challenges in achieving both good sensor performance and reliable galvanic isolation between the busbar and the sensor chip, particularly due to the risk of air breakdowns and short circuits caused by delamination and air bubble formation during aging processes.
Innovation Solution
The sensor device incorporates a dielectric shell and layer arrangement that ensures a minimum distance of greater than 400 micrometers between the sensor chip and the busbar, with the dielectric shell projecting beyond the busbar edge to enhance galvanic isolation and prevent air breakdowns and short circuits.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dielectric layer is arranged between the busbar and the sensor chip, then galvanic isolation is improved, but air breakdowns and short circuits may occur due to delamination and air bubble formation during aging
Solution Approach 1:
The dielectric structure is divided into multiple segments: a first dielectric layer arranged between the busbar and the sensor chip, and a second dielectric layer arranged between the first dielectric layer and the sensor chip. This segmentation creates multiple isolation barriers, preventing air breakdowns and short circuits by eliminating continuous air paths that could form during aging processes.
Solution Approach 2:
The first dielectric layer acts as an intermediary between the busbar and the sensor chip, providing galvanic isolation. The second dielectric layer acts as an intermediary between the first dielectric layer and the sensor chip, further enhancing isolation. These intermediary dielectric layers prevent direct contact and eliminate harmful air gaps that could lead to breakdowns.
2Reliability
If the dielectric shell projects beyond the busbar edge, then galvanic isolation is enhanced, but device complexity increases
Solution Approach 1:
The dielectric shell extends in the lateral dimension beyond the busbar edge, creating an overlapping region between the dielectric shell and the sensor chip. This dimensional extension provides additional galvanic isolation path without requiring increased vertical height, thus enhancing isolation while controlling overall device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the robustness of the sensor device by preventing air breakdowns and short circuits, ensuring reliable operation and increased galvanic isolation, thereby enhancing the device's reliability and performance.
Implementation Method 1
a sensor chip configured to detect a magnetic field induced by an electric measurement current flowing through the busbar
Implementation Method 2
a dielectric shell arranged over the busbar; a dielectric layer arranged over the busbar
Data Source
AI summary
A sensor device contains a busbar, a dielectric shell arranged over the busbar, a dielectric layer arranged over the busbar, and a sensor chip arranged within the dielectric shell, wherein the sensor chip is configured to detect a magnetic field induced by an electric current flowing through the busbar.