Ceramic Element Surface-Mount Terminal Structure for Flexible Assembly
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Solution Overview
Problem
Conventional electronic devices for surface mounting require a complex assembly process and are inflexible to changes in the size of the dielectric disk, necessitating the use of molding dies that complicate production.
Innovation Solution
An electronic device design featuring a case with a recessed portion housing a ceramic element, where metal terminals are integrated with electrode connections, allowing for flexible size adjustments and reduced assembly complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the dielectric disk or metal terminals are molded with an exterior material after fixing in a cavity for resin molding, then the component has a form suitable for surface mounting, but the assembly process becomes complicated
Solution Approach 1:
The mounting portions are formed directly on the case during case molding, before the ceramic element and metal terminals are assembled. This preliminary formation of mounting structures eliminates the need for subsequent molding operations after assembly, simplifying the overall assembly process while maintaining surface mounting capability
Solution Approach 2:
The case serves multiple functions: it houses the ceramic element, provides structural support, and incorporates the mounting portions directly into its structure. This multi-functionality eliminates the need for separate exterior molding operations, reducing assembly complexity while maintaining surface mounting capability
2Manufacturing precision
If the molding die is changed according to changes in the size of the dielectric disk, then the component can be molded to the correct size, but it becomes difficult to respond flexibly to size changes
Solution Approach 1:
The mounting portions are segmented from the ceramic element itself and formed directly on the case, rather than being part of a separate molding operation. This segmentation allows the case to accommodate different ceramic element sizes without requiring changes to a dedicated molding die, improving flexibility while maintaining precision through direct formation
Solution Approach 2:
The mounting portions are formed with dimensions that can accommodate variations in ceramic element size. By designing the mounting portion geometry to be adaptable within a range of sizes, the system can respond flexibly to size changes without requiring complete redesign of the molding die
3Ease of operation
If the metal terminals are positioned away from the electrode connection portions, then the terminals can be mounted on the surface, but the resistance value at the metal terminals increases
Solution Approach 1:
The mounting portions and electrode connection portions are merged into a single integrated metal terminal structure. This combination minimizes the length of the conductive path between the electrode connection and the mounting surface, reducing resistance while maintaining surface mounting capability
Data Source
AI summary
The electronic device includes: a case including a recessed portion and an opening edge portion of the recessed portion; a ceramic element arranged in the recessed portion, having a first main surface and a second main surface facing each other, and including a first electrode portion formed on the first main surface and a second electrode portion formed on the second main surface; a first metal terminal including a first mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a first electrode connection portion connected to the first electrode portion; and a second metal terminal including a second mounting portion, arranged in the opening edge portion and approximately horizontal with respect to the first main surface and the second main surface, and a second electrode connection portion connected to the second electrode portion.