Multilayer Ceramic Terminal Structure to Prevent Interface Peeling
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Solution Overview
Problem
Conventional multilayer ceramic electronic components face issues with peeling at the interface between metal terminals and the exterior material, leading to potential vapor ingress and reduced reliability.
Innovation Solution
The design incorporates metal terminals with protruding portions having an undercut shape and a multilayer ceramic electronic component structure that enhances bonding by including a first and second outermost surface metal film, along with a bonding material, to prevent peeling and improve adhesion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a plating film is provided on the metal terminal to enhance bonding properties, then bonding strength is improved, but peeling occurs at the interface between the metal terminal and exterior material due to the smooth surface
Solution Approach 1:
The patent applies a porous coating layer on the metal terminal surface that contains numerous protruding portions. This porous structure provides mechanical interlocking with the exterior material, preventing peeling while maintaining bonding strength. The protruding portions extend into the exterior material, creating anchor points that resist delamination forces.
Solution Approach 2:
The patent uses a composite structure combining a metal terminal base layer with a porous coating layer containing protruding portions. This composite design allows the smooth metal surface to provide bonding strength while the porous outer layer provides mechanical interlocking and prevents peeling, resolving the contradiction between bonding strength and interface reliability.
2Strength
If the metal terminal surface is made smooth to improve bonding, then bonding properties are enhanced, but peeling occurs allowing vapor ingress
Solution Approach 1:
The porous coating layer with protruding portions creates a physical barrier that prevents vapor from reaching the metal terminal interface. The protruding portions extend into the exterior material, blocking vapor pathways and preventing ingress to the internal components, thus resolving the vapor ingress issue while maintaining bonding properties.
3Strength
If a plating film is added to enhance bonding, then bonding strength improves, but the structure becomes more complex
Solution Approach 1:
The porous coating layer is applied as a surface treatment on the metal terminal, creating protruding portions through a single additional processing step. This approach enhances bonding strength through mechanical interlocking without requiring multiple separate components or complex assembly procedures, thus minimizing structural complexity while achieving the bonding improvement.
Data Source
AI summary
A layered ceramic electronic component includes a layered ceramic electronic component body, metal terminals connected to external electrodes via a bonding material, and an exterior material covering the layered ceramic electronic component body. The metal terminals include bonding surfaces bonded to a bonding material, and contact surfaces that contact the exterior material. The contact surfaces include outermost surface metal films on at least a portion thereof, and exposed surfaces including protrusions made of a metal differing from a metal of the outermost surface metal films, and that have an undercut shape.