Passive Component Miniaturization via Composite Paste and Curing
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Solution Overview
Problem
The production process of passive components for smaller, thinner, and lightweight designs is complex and difficult, limiting their miniaturization and increasing demand for higher quality components in consumer electronics.
Innovation Solution
A multi-step process involving reformation, high-temperature reaction, composite paste preparation, light curing, packaging, heat curing, pin cutting, silver paste coating, heating, and laser engraving to produce compact, lightweight passive components with extended service life and broader applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If traditional production processes are used for passive components, then manufacturing experience and established methods are maintained, but the components cannot achieve thinner, smaller, and lightweight designs
Solution Approach 1:
The production process is divided into multiple sequential steps including reforming, high-temperature reaction, paste preparation, dipping, light curing, packaging, heat curing, pin cutting, silver paste coating, heating, and laser engraving. This segmentation allows each step to be optimized independently for miniaturization while maintaining manufacturing feasibility.
Solution Approach 2:
The reforming step is performed as a preliminary action before the main production process, where hydrogen peroxide solution is used to oxidize and lengthen electrode pins. This preliminary treatment prepares the components for subsequent miniaturization steps by ensuring proper pin dimensions and surface properties.
2Productivity
If component size is reduced for miniaturization, then density per unit area increases, but production complexity and difficulty increase
Solution Approach 1:
The process utilizes parameter changes at multiple stages: temperature changes during high-temperature reaction and heat curing, light exposure during light curing, and chemical concentration changes during paste preparation. These parameter changes enable precise control of material properties to achieve miniaturization while managing production complexity.
Solution Approach 2:
A composite paste is prepared by mixing flexible epoxy with micro-scale and nanoscale thermal conductive layered materials. This composite material provides both structural integrity and thermal management properties essential for miniaturized components, allowing high density per unit area without compromising performance.
3Reliability
If electrode pins are lengthened through oxidation, then connection reliability improves, but additional processing steps are required
Solution Approach 1:
Hydrogen peroxide solution is used as a strong oxidant to accelerate the oxidation of electrode pins, rapidly lengthening them to the required dimensions. This accelerated oxidation method achieves reliable electrode connections more efficiently than natural oxidation, justifying the additional processing step.
Solution Approach 2:
The hydrogen peroxide solution acts as an intermediary chemical agent that facilitates the oxidation process. It temporarily modifies the electrode pin surface and structure, enabling reliable connections, and is then removed or stabilized in subsequent processing steps.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates the production of passive components with easier and more convenient manufacturing, achieving a compact, lightweight design with extended service life and broader applications in consumer electronics.
Implementation Method 1
Ultra-high concentrated hydrogen peroxide solution in which at least 10% hydrogen peroxide gas and carbon dioxide gas are dissolved is used as an oxidizing agent and a current is applied for repairing reoxidation and oxidation of the capacitor element 1. The electrode pins 11 are also oxidized
Implementation Method 2
apply high temperature to the capacitor element 1 already reformed after the step A to react completely and release gas. The high temperature is at least 150° C. and preferably ranging from 180° C. to 250° C.
Implementation Method 3
move the capacitor element 1 into a processing tank with a vacuum pump device and a light curing device for vacuum pumping and light curing of the composite paste on the capacitor element 1
Implementation Method 4
move the capacitor element 1 to a processing tank with a vacuum pump device and a high temperature heater for being treated by vacuum pumping and high temperature heating after the step E
Data Source
AI summary
A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.