Built-in Self-Test Routing for Modular System-on-Chip Modules
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Solution Overview
Problem
Modular integrated circuit devices with multiple modules operating under different protocols face challenges in on-board self-testing due to lack of interconnections, requiring slow and expensive external testing.
Innovation Solution
A system-on-chip integrated circuit device with a built-in self-test circuit module that uses an interconnect fabric to route test data through selected functional circuit modules, allowing testing under the same operational mode as run-time operations and across different protocols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external testing is used for modular integrated circuit devices, then testing can be performed on modules operating under different protocols, but testing speed is slow and cost is high
Solution Approach 1:
The modular integrated circuit device performs self-testing using built-in test pattern generation circuitry, test pattern checker circuitry, and interconnect fabric that are integrated within the device itself, eliminating the need for external testing equipment and enabling fast on-board self-test operations
Solution Approach 2:
The interconnect fabric serves multiple functions by routing both normal operational data traffic between modules and test patterns during self-testing operations, allowing the same infrastructure to support both runtime communication and testing across modules operating under different protocols
2Reliability
If external testing equipment is used, then testing can be performed, but testing cost is high
Solution Approach 1:
The device includes integrated test pattern generation circuitry and test pattern checker circuitry that enable self-testing without requiring expensive external testing equipment, reducing testing costs while maintaining comprehensive testing capability across modules operating under different protocols
Solution Approach 2:
The test pattern generation circuitry, test pattern checker circuitry, and interconnect fabric are merged into a single integrated self-test system within the modular integrated circuit device, consolidating testing functions that would otherwise require separate external equipment into one cost-effective on-board solution
3Adaptability or versatility
If modules are provided separately by different entities, then modular flexibility is achieved, but interconnections for on-board self-testing are lacking
Solution Approach 1:
The interconnect fabric is designed to universally support both normal operational data routing between independently provided modules and test pattern routing during self-testing, eliminating the need for separate dedicated test interconnections and reducing overall device complexity while maintaining modular flexibility
Solution Approach 2:
The interconnect fabric acts as an intermediary that mediates between independently provided modules during both operational and testing phases, providing a unified communication infrastructure that simplifies interconnection requirements while enabling both modular flexibility and on-board self-testing capability
Data Source
AI summary
A system-on-chip integrated circuit device includes a plurality of functional circuit modules, at least a first circuit module of the plurality of functional circuit modules operating under a first protocol, the first protocol being an interface protocol for communicating outside the system-on-chip integrated circuit device, an interconnect fabric coupled to the functional circuit modules in the plurality of functional circuit modules, and a built-in self-test circuit module coupled to the interconnect fabric. The built-in self-test circuit is configured to test one or more selected functional circuit modules in the plurality of functional circuit modules, including at least the first circuit module under the first protocol for communicating outside the system-on-chip integrated circuit device, by routing test data through the one or more selected functional circuit modules.