Bump Electrode Etching for Display Panel Adhesion
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable bonding between the display panel and electronic components, particularly due to protrusions formed during the etching process, which can lead to gaps and poor adhesion, affecting the electrical connection and durability.
Innovation Solution
A method of manufacturing display devices involves primary and secondary etching of conductive layers to form bump electrodes with specific side surface profiles, ensuring no protrusions are formed, and using a conductive adhesive member that contacts the entire surface of the electrodes for robust bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a single etching process is used to form bump electrodes, then the manufacturing process is simple, but protrusions are formed on the electrode surface leading to poor adhesion and gaps
Solution Approach 1:
The single etching process is divided into two sequential etching steps: a first etching process that forms preliminary bump electrodes with initial protrusions, and a second etching process that selectively removes these protrusions to create a flat surface. This segmentation allows each step to be optimized independently, achieving both manufacturing efficiency and surface precision.
Solution Approach 2:
The first etching process performs the preliminary action of forming bump electrodes with protrusions that will later be removed. This preliminary formation allows for better adhesion of the conductive adhesive member during the intermediate state, and the subsequent second etching process completes the refinement to achieve the final flat surface, ensuring optimal bonding reliability.
2Manufacturing precision
If protrusions are formed on bump electrodes during etching, then the electrode structure is created, but gaps and poor adhesion occur with the conductive adhesive member
Solution Approach 1:
The harmful protrusions that cause gaps and poor adhesion are selectively removed in the second etching process. This extraction of the defective portions leaves a flat electrode surface that ensures complete contact with the conductive adhesive member, eliminating gaps and improving bonding reliability while maintaining the essential bump electrode structure for electrical connection.
Solution Approach 2:
The protrusions formed in the first etching process, which initially appear harmful, are actually utilized as a beneficial intermediate state. These protrusions provide enhanced adhesion sites for the conductive adhesive member during the bonding process, and their subsequent controlled removal in the second etching process creates the optimal flat surface, thus converting the potential defect into a process advantage.
3Ease of manufacture
If the conductive adhesive member does not contact the entire electrode surface, then the application process is simple, but electrical connection reliability deteriorates
Solution Approach 1:
The flat surface of the bump electrodes, achieved through the two-step etching process, enables the conductive adhesive member to spread uniformly across the entire electrode surface through capillary action and surface tension. This complete contact is achieved simply by applying the adhesive and pressing, without requiring complex application equipment, thus maintaining manufacturing simplicity while ensuring reliable electrical connection.
Data Source
AI summary
Disclosed is a method of manufacturing a display device, the method including manufacturing an electronic component and attaching the electronic component to a display panel using a conductive adhesive member. The manufacturing of the electronic component includes providing a substrate and a conductive layer disposed on the substrate, a primary etching of the conductive layer to form a preliminary bump electrode, and a secondary etching of the preliminary bump electrode to form a bump electrode.