Printed Circuits TRIZ Cases

A deformed portion of the auxiliary member pushes up to lift terminal portions, preventing damage during assembly.

A shield connector uses a metallic shell leveling arrangement to create a coplanar supporting plane.

U-shaped flexible printed circuit boards connect front and rear liquid crystal display panels using thermo-compression bonding.

Variable auxiliary and connection line widths equalize signal resistance while preventing disconnections caused by glass debris contamination.

A connector uses staggered signal and ground contacts to increase horizontal spacing between adjacent pairs.

A display panel incorporates a shielding structure covering the bonding area to maintain edge color consistency.

Composite epoxy resin with brominated components improves insulation reliability while preventing copper ion migration.

A display substrate design uses segmented conductive patterns linked by insulation layer via-holes to route common voltage signals across peripheral regions.

Multi-row contact arrangement increases spacing between signal pairs to reduce cross-talk while maintaining uniform impedance across the connector.

Conductive ink fills a micro hole in the pad part to connect components, reducing manufacturing time and costs.

Sprayed metal powder forms conductive paths between display pads, reducing bezel area and manufacturing complexity.

A flexible wiring board connects display and touch panels with distinct terminal spacing to accommodate positional shifts.

Segmented organic film layer enables direct barrier-to-inorganic contact for robust display panel construction.

Adhesive layer positioning overlaps bumps to prevent MEMS substrate warping and ensure stable electrode connections.

Dividing repair lines into sub-lines minimizes resistive-capacitive loading, preserving signal transmission quality across multiple defective rows.

Flared contact beams abut housing surfaces to prevent body bowing and deformation caused by uneven gap distribution during press-fit mounting.

A curable resin composition with terminal reactive groups enhances solvent solubility and heat resistance.

A graphics card connector module couples MXM format cards to desktop motherboards via a single PCI-Express slot interface.

Automated system separates printed circuit boards from reflow carriers using clip unlocking and robotic pickup mechanisms to prevent pin loss during transport.

Crosslinked polyimide with a refractive index of 1.74 or less enables deep saturated colors while resisting etching damage.

Segmented conductive pattern layers expose insulation surfaces to distribute bonding stress and resolve defects in display device signal pads.

Interference fit between surface mount projections and guide pins prevents component damage during board-to-board alignment.

A display device integrates a reinforcing member between main and bent sub-areas to mount circuit components directly.

Protruding insulating patterns on side pads improve compression consistency and bonding reliability between display pads and driving chips.

Bending the flexible circuit board around sidewalls and maintaining constant spacing between molds stabilizes the component against physical stress.

A surface mount stud carrier assembly provides high current electrical connections between a printed circuit board and an external heat sink.

Multi-layer PCB antenna patterns with ferrite shielding resolve interference and thickness constraints for compact NFC USIM devices.

A USB connector uses dual-surface lead placement to isolate differential signals and minimize crosstalk between high-speed data lines.

A support layer between the display panel and wiring substrate prevents air gaps during assembly.

A flexible printed circuit opening exposes the adhesive region, allowing precise electrical connections while resolving assembly tolerance issues.

Alternating touch pads and dummy pads on a display device reduce signal interference between adjacent electrodes while maintaining sensitivity.

Segmented wiring substrate connects to outer routing lines on a display panel, eliminating dead zones that restrict design flexibility.

A stepped power inverter housing supports external cooling bodies that dissipate heat from overlapping printed circuit boards.

Opposing signal and power layers cancel induced electromotive forces, preventing switching noise from disrupting data transmission reliability.

Inverted connector housing protrudes through substrate to minimize height profile, preventing obstruction of LED light emission.

Longitudinal and transverse portions of a repairing line bridge gate line disconnections, resolving manufacturing defects without adding post-process steps.

Segmenting the circuit into flexible and rigid boards reduces noise and vibration damage while maintaining signal stability.

Molded insulating ribs on the first wiring board project through holes in the second board, eliminating custom cover molds and reducing production costs.

A resin composition blends thermosetting and soluble polyimide resins to enable spin-on dielectric packaging.

Convex encapsulation portions overlap the pad area to expand cover member contact, preventing lifting and substrate cracks.

Optical beam shaping creates a bell-shaped power density distribution along the imaging depth to weld copper components on ceramic substrates.

Dual etching creates flat bump electrodes, eliminating gaps and ensuring reliable electrical connections.

Replacing rigid glass with a flexible base film resolves the contradiction between structural protection and foldability in display devices.

A display device connects pads to flexible films through substrate openings.

Dynamic vacuum plate movement maintains relative speed above threshold, compensating frictional forces during intermittent web stops.

Segmented carriers with spaced connectors distribute tensile forces to prevent line pattern damage in curved displays.

Hydrogen bonding between modified copolymer units reduces thermal expansion while maintaining moldability and heat resistance.

Silicon nitride and oxide barrier layers on a conductive carrier prevent short circuits from impurities while maintaining optical transparency.

Springs bias a heat sink against a thermal pad, preventing rattling noise while ensuring efficient heat dissipation in compact set top boxes.