Support Layer and Chamfer Structure for Transparent Display Bonding

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Solution Overview

Problem

Existing display devices face issues such as the formation of dead zones, air gaps between the display panel and wiring substrate, and defects in the bonding agent application, which affect the transparency and reliability of the display.

Innovation Solution

A display device configuration that includes a display panel with routing lines on one side, a wiring substrate connected to these lines, and a support layer between the panel and substrate to prevent air gaps and ensure proper bonding, while also using a chamfer structure to prevent bonding agent defects.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a wiring substrate is disposed on the lower surface of the display panel without a support layer, then the structure is simpler and manufacturing is easier, but air gaps form between the display panel and wiring substrate causing stain defects and reducing reliability

Engineering Contradiction:
Improvebonding reliabilityVSAvoidstructure complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

A support layer is introduced as an intermediary component between the display panel and the wiring substrate. This support layer prevents air gaps from forming during the bonding process, ensuring reliable attachment while maintaining a relatively simple overall structure. The support layer acts as a mediator that facilitates proper bonding without requiring complex bonding mechanisms.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Manufacturing precision

If the support layer does not extend under the connection lines, then the manufacturing process is simpler and faster, but bonding agent cannot properly fill the edge areas causing non-filling defects

Engineering Contradiction:
Improvebonding agent fillingVSAvoidmanufacturing efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The support layer is designed to extend beyond the connection lines in advance, creating a prepared surface that allows bonding agent to properly fill all edge areas before the actual bonding process occurs. This preliminary extension of the support layer prevents non-filling defects and ensures complete bonding agent coverage, while the extended portion can be easily removed or trimmed after bonding, maintaining manufacturing efficiency.

Inventive Principle:
Principle #10Preliminary action

3Illumination intensity

If routing lines are disposed on the outer surface of the display panel without a separate wiring substrate, then the device structure is simpler, but dead zones are formed and transparency is reduced

Engineering Contradiction:
ImprovetransparencyVSAvoidstructure complexity
Core Design Contradiction:
Illumination intensityVSDevice complexity

Solution Approach 1:

The device is segmented into separate functional components: the display panel with routing lines on its outer surface, and a separate wiring substrate with connection lines on its lower surface. This segmentation allows the display panel to maintain its transparency by keeping routing lines on the outer surface, while the separate wiring substrate handles the connection functionality, eliminating dead zones and maintaining overall structural simplicity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS20240373700A1Display device
Publication Date: 2024.11.07 LG DISPLAY CO LTD
  • US20240373700A1 patent drawing
  • US20240373700A1 patent drawing
  • US20240373700A1 patent drawing

AI summary

A display device according to an example of the present disclosure can include a display panel having a plurality of pixels, a plurality of routing lines disposed on an outer surface at one side of the display panel, a wiring substrate disposed on a lower surface of the display panel and having a plurality of connection lines respectively connected to the plurality of routing lines, and a support layer disposed between the display panel and the wiring substrate and extending toward a lower side of the plurality of connection lines, thereby reducing manufacturing costs without a design constraint which can be caused by a dead zone.