Display Pad Protruding Insulating Pattern Bonding Reliability
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Solution Overview
Problem
Existing display devices face challenges in achieving reliable bonding between pads and driving chips, which can lead to poor connectivity and reduced performance.
Innovation Solution
The display device incorporates side pads with a specific structure, including a first conductive pattern, a first insulating pattern with protruding patterns, and a second insulating pattern, to enhance bonding reliability. This structure includes a valley recessed towards the base layer between the protruding patterns, with the second insulating pattern overlapping this valley.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional pad structures are used, then manufacturing is simpler, but bonding reliability between pads and driving chip deteriorates
Solution Approach 1:
The pad structure is segmented into multiple functional layers: a first insulating pattern with protruding patterns for mechanical interlocking, a second insulating pattern for additional bonding surface, and conductive patterns for electrical connection. This segmentation allows each layer to contribute specifically to bonding reliability while maintaining manufacturing feasibility through standardized layering processes.
Solution Approach 2:
The protruding patterns extend in the third dimension (vertical direction) from the base layer, creating a three-dimensional bonding interface. This dimensional change increases the bonding surface area and mechanical interlocking capability between pads and driving chip, thereby improving bonding reliability without significantly increasing planar footprint.
2Reliability
If pads with uniform structure are used, then manufacturing is easier, but compression amount varies across different positions leading to poor bonding consistency
Solution Approach 1:
The pad structure implements local quality by positioning specific components at strategic locations: protruding patterns are placed at contact points with the driving chip to enhance local bonding, the second insulating pattern is positioned to fill valleys and provide localized bonding support, and conductive patterns are strategically arranged for optimal electrical connection. This localized optimization ensures consistent bonding performance across all pad positions while maintaining manufacturing efficiency through pattern repetition.
Data Source
AI summary
A display device includes: a base layer including a display area and a non-display area adjacent to the display area, insulating layers arranged on the base layer, pixels arranged in the display area, pads connected to the pixels, arranged in a first direction, and arranged in the non-display area, and a driving chip connected to the pads. Each of side pads arranged at opposite ends in the first direction among the pads includes: a first conductive pattern; a first insulating pattern including protruding patterns, which protrude in a direction toward the driving chip; and a second insulating pattern disposed on the first insulating pattern.