Curable Resin Composition for High-Frequency Insulation
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Solution Overview
Problem
Existing vinyl group-containing curable resins, such as polyvinylbenzyl ethers, fail to provide a cured article with both low dielectric loss tangent and high heat resistance required for high-frequency electrical insulating materials, and they also have poor solvent solubility affecting moldability.
Innovation Solution
A curable resin composition comprising a curable resin (A) with a specific structure, containing a repeating unit with reactive groups like (meth)acryloyloxy, vinylbenzyl ether, or allyl ether, and a curable compound (B), which enhances solvent solubility, heat resistance, and dielectric properties of the cured article.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If vinyl group-containing curable resins such as polyvinylbenzyl ether are used, then the dielectric properties are improved, but the heat resistance and solvent solubility deteriorate
Solution Approach 1:
The patent uses a composite curable resin system combining polyvinylbenzyl ether (for low dielectric loss tangent) with polyarylate resin containing reactive groups (for heat resistance and solvent solubility). This composite approach allows the cured article to achieve both excellent dielectric properties and high heat resistance while maintaining good solvent solubility for moldability.
Solution Approach 2:
The patent modifies the chemical structure parameters of the curable resin by introducing specific reactive groups ((meth)acryloyloxy, vinylbenzyl ether, or allyl ether groups) at the terminal structures of the polyarylate resin. This structural parameter change enables the resin to achieve both low dielectric loss tangent and high heat resistance simultaneously.
2Reliability
If vinyl group-containing curable resins such as polyvinylbenzyl ether are used, then the dielectric properties are improved, but the heat resistance deteriorates
Solution Approach 1:
The patent combines polyvinylbenzyl ether (providing low dielectric loss tangent) with polyarylate resin containing reactive groups (providing high heat resistance through aromatic structures and crosslinking). The synergistic effect of this composite system achieves both excellent dielectric properties and high heat resistance suitable for lead-free solder processing.
Solution Approach 2:
The patent introduces reactive groups specifically at the terminal structures of the polyarylate resin molecules, creating local regions of high reactivity and thermal stability. This localized structural modification allows the resin to achieve high heat resistance while maintaining the low dielectric loss tangent property of the polyvinylbenzyl ether backbone.
3Reliability
If conventional curable resins are used, then the dielectric loss tangent is reduced, but the glass transition temperature is insufficient
Solution Approach 1:
The patent changes the chemical structure parameters by introducing rigid aromatic rings and reactive terminal groups into the resin system. The polyarylate resin backbone with aromatic structures provides high glass transition temperature, while the terminal reactive groups enable crosslinking that further enhances thermal stability. This structural parameter change achieves both low dielectric loss tangent and high glass transition temperature.
Solution Approach 2:
The patent creates a composite system where polyvinylbenzyl ether provides low dielectric loss tangent and polyarylate resin with reactive groups provides high glass transition temperature through its aromatic structure and crosslinking capability. The synergistic combination of these two resin components achieves both desired properties simultaneously.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curable resin composition achieves excellent solvent solubility, leading to improved moldability, and provides a cured article with enhanced heat resistance and low dielectric properties, making it suitable for high-frequency electrical insulating materials.
Implementation Method 1
a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure
Data Source
AI summary
An object of the present invention is to provide a curable resin composition having excellent solvent solubility, heat resistance (high glass transition temperature), and dielectric properties (low dielectric properties), and a cured article thereof. Specifically, the curable resin composition includes a curable resin (A) that has a repeating unit represented by General Formula (1) and contains one or more reactive groups selected from the group consisting of a (meth)acryloyloxy group, a vinylbenzyl ether group, and an allyl ether group as a terminal structure, and a curable compound (B) represented by General Formula (2).The details of the substituent represented by General Formula (1) and the number of substituents are as described in the specification.The details of the substituent represented by General Formula (2) and the number of substituents are as described in the specification.