Convex Encapsulation Layer for Display Pad Area Support
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Display devices, particularly organic light emitting diode (OLED) displays, face challenges in durability due to potential cracks in the array substrate and lifting phenomena of the cover member, which can compromise the device's performance and longevity.
Innovation Solution
The display device incorporates an array substrate with a specific configuration, including a display area, a peripheral area, and a pad area. This configuration features a convex encapsulation layer that overlaps the pad area, providing additional thickness and support, and a cover member that contacts the convex portions, expanding the contact surface and reducing the likelihood of lifting.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the encapsulation layer is extended to cover the pad area with convex portions, then the contact surface area between the cover member and the encapsulation layer is increased, but the structural complexity of the encapsulation layer is increased
Solution Approach 1:
The encapsulation layer is extended in the planar dimension to cover the pad area where driving chips are mounted, creating convex portions that protrude toward the pad area. This dimensional extension increases the contact surface area between the cover member and encapsulation layer, preventing lifting phenomena and improving durability without requiring additional components or complex assembly processes.
2Length of stationary object
If the cover member is placed closer to the array substrate to reduce device thickness, then the overall device profile is improved, but the contact surface area between the cover member and the encapsulation layer is reduced
Solution Approach 1:
Instead of increasing vertical thickness, the encapsulation layer is extended in the planar dimension to create convex portions that protrude toward the pad area. This allows the cover member to contact the encapsulation layer at multiple points across the convex portions, maintaining adequate contact surface area while keeping the overall device profile thin.
3Strength
If the convex portions of the encapsulation layer extend further into the pad area, then the support and protection for the driving chips is improved, but the area available for other components is reduced
Solution Approach 1:
The encapsulation layer is designed with localized convex portions that extend only to specific regions where driving chips are mounted. This local extension provides targeted support and protection where needed, while leaving other areas of the pad area available for additional components or routing, thus balancing structural support with component placement flexibility.
Data Source
AI summary
A display device includes an array substrate including a display area including pixels, a peripheral area and a pad area, in order in a first direction, driving chips on the array substrate, in the pad area, the driving chips arranged spaced apart from each other along a second direction intersecting the first direction, an encapsulation layer on the array substrate and covering the pixels, the encapsulation layer including a base portion overlapping the display area and the peripheral area, and convex portions protruding from a side of the base portion, in the first direction, the convex portions overlapping the pad area, and a cover member covering the driving chips, in the pad area, the cover member contacting the convex portions of the encapsulation layer.