Display Device Pad Connection via Substrate Opening
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Solution Overview
Problem
Existing display device fabrication processes are inefficient due to large non-display areas and complex manufacturing steps, leading to increased time and cost.
Innovation Solution
A display device design where pads on a substrate are electrically connected to flexible films underneath, reducing non-display areas and simplifying the fabrication process by eliminating the need for ultrasonic or thermocompression bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If pads on substrate are connected to flexible films using traditional ultrasonic or thermocompression bonding, then electrical connection is achieved, but fabrication process becomes complex and time-consuming
Solution Approach 1:
The patent extracts and eliminates the complex bonding processes (ultrasonic or thermocompression bonding) from the fabrication sequence. By removing these unnecessary steps and directly forming electrical connections through contact holes and conductive layers, the process complexity is reduced while maintaining connection reliability
Solution Approach 2:
The contact holes and conductive pathways are formed in advance during substrate processing, before the flexible film is integrated. This preliminary preparation of connection structures eliminates the need for subsequent bonding operations and streamlines the overall fabrication process
2Reliability
If traditional display device layout is used, then electrical connections are established, but non-display area increases and fabrication time increases
Solution Approach 1:
The patent merges the electrical connection function directly into the substrate structure through integrated contact holes and conductive layers. This integration eliminates separate bonding steps and reduces the non-display area required for connection structures, thereby decreasing fabrication time while maintaining reliable electrical connections
Solution Approach 2:
The connection structures are formed in the vertical dimension (through contact holes penetrating the substrate) rather than requiring extensive horizontal space. This dimensional approach allows electrical connections without increasing the non-display area footprint, accelerating fabrication throughput
3Reliability
If pads are connected to flexible films through multiple bonding steps, then connection is achieved, but fabrication cost increases
Solution Approach 1:
The patent removes expensive and time-consuming bonding steps (ultrasonic bonding, thermocompression bonding) from the manufacturing process. By forming electrical connections directly through substrate contact holes and conductive layers, fabrication cost is reduced while connection reliability is maintained
Solution Approach 2:
The substrate structure itself provides the connection pathway through its own contact holes and conductive layers, eliminating the need for separate bonding operations. This self-contained approach reduces manufacturing complexity and cost while ensuring reliable electrical connections
Data Source
AI summary
A display device includes a substrate having a first side surface adjacent to an upper surface, a second side surface adjacent to a lower surface, and an opening surrounded by the second side surface, a pad clad surrounded by the first side surface of the substrate and including a pad contact hole, a pad disposed on the pad clad and inserted into the pad contact hole, a fan-out line disposed on the pad and electrically connected to the pad, a transistor electrically connected to the fan-out line, and a flexible film disposed under the substrate and including a lead electrode inserted into the opening of the substrate and in contact with the pad.