USB 3.0 Connector Dual-Surface Lead Layout for Crosstalk Reduction
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Solution Overview
Problem
USB 3.0 connectors require a new connector structure to support higher signal transmission rates compared to USB 2.0, while maintaining compatibility with existing USB 2.0 connectors, and existing solutions fail to effectively reduce signal crosstalk and improve transmission performance.
Innovation Solution
The electric connector features a metallic case with an insulating base, first leads for differential signals and a ground lead on one surface, and second leads including a power lead and differential signals on the opposite surface, arranged to maximize spacing and reduce crosstalk, with additional features like reference planes for shielding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If USB 3.0 adopts the same connector structure as USB 2.0 with additional pins, then compatibility with USB 2.0 is maintained, but signal transmission performance and crosstalk reduction are insufficient
Solution Approach 1:
The connector is segmented into two separate contact assemblies: a first contact assembly for USB 2.0 signals (D+, D-, GND) and a second contact assembly for USB 3.0 signals (TX+, TX-, RX+, RX-, GND). This segmentation isolates high-speed USB 3.0 differential signals from USB 2.0 signals, reducing crosstalk while maintaining backward compatibility through the retained USB 2.0 contact assembly.
Solution Approach 2:
The patent introduces a new spatial dimension by adding a second contact assembly adjacent to the first contact assembly. The USB 3.0 contacts are positioned in a separate plane or layer, allowing independent routing and shielding strategies. This dimensional separation enables high-speed signals to be isolated from lower-speed signals while maintaining the original USB 2.0 connector interface.
2Reliability
If spacing between signal leads is increased to reduce crosstalk, then signal transmission performance improves, but connector size and complexity increase
Solution Approach 1:
The second contact assembly for USB 3.0 signals is nested within or adjacent to the first contact assembly for USB 2.0 signals. The contact assemblies share common structural elements such as the insulating base, metallic case, and grounding framework. This nesting approach allows increased spacing between differential signal pairs for reduced crosstalk while utilizing shared structural components to minimize overall connector complexity.
Solution Approach 2:
Both contact assemblies share common structural support elements including the insulating base, metallic shielding case, and grounding system. The first and second differential signal lead pairs are routed through shared structural pathways with optimized spacing. This merging of common infrastructure reduces the overall complexity increase that would result from completely separate connector designs.
Data Source
AI summary
An electric assembly includes a circuit board and an electric connector. The circuit board comprises a first surface and a second surface opposite thereto. The electric connector includes a metallic case, an insulating base, first leads and second leads. The insulating base is connected with the metallic case. The first leads are disposed on the insulating base and soldered to the first surface. The first leads includes a pair of first differential signal leads, a pair of second differential signal leads and a ground lead located between the pair of first differential signal leads and the pair of second differential signal leads. The second leads are disposed on the insulating base and soldered to the second surface. The second leads include a power lead, a second ground lead and a pair of third differential signal leads located between the power lead and the second ground lead.