Display Substrate Via-Hole Segmentation for Uniform Voltage
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Solution Overview
Problem
In large Liquid Crystal Display (LCD) devices, ensuring uniformity of display by applying a common voltage to common electrode lines is challenging due to the need for a common electrode bus outside the display region, which can lead to issues like high contact resistance and heating at joints, especially when using copper lines.
Innovation Solution
A display substrate design with a common electrode line extending into both the display and peripheral regions, featuring a first conductive pattern, an insulation layer with a via-hole, and a second conductive pattern connected to the first pattern, allowing the common electrode line to be electrically connected to a common electrode bus, thereby applying a uniform common voltage and reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a common electrode bus is provided outside the display region to connect common electrode lines, then display uniformity is improved, but contact resistance and heating issues occur at joints
Solution Approach 1:
The common electrode connection is divided into multiple segments: common electrode lines within the display region, first conductive patterns at the peripheral region, second conductive patterns, and common electrode bus. This segmentation allows each component to be optimized independently, with the via-holes connecting different segments without directly contacting the copper lines, thereby reducing contact resistance and heating while maintaining uniform voltage distribution.
Solution Approach 2:
The insulation layer with via-holes acts as an intermediary between the common electrode lines and the common electrode bus. The via-holes provide electrical connection paths that do not require direct contact between copper lines and bus, serving as mediators that reduce contact resistance and prevent heating issues while still transmitting the common voltage signal.
2Reliability
If copper lines are used for common electrode lines, then electrical conductivity is improved, but heating issues occur at joints
Solution Approach 1:
The insulation layer with via-holes serves as an intermediary that separates the copper common electrode lines from the connection points. This prevents direct thermal accumulation at joints between copper lines and bus, as the via-holes provide alternative connection paths that distribute thermal stress and prevent localized heating, while still maintaining excellent electrical conductivity through the conductive patterns.
Data Source
AI summary
A display substrate, a manufacturing method thereof and a display device are provided. The display substrate includes a display region and a peripheral region surrounding the display region, and includes: a common electrode line extending in a first direction on a base substrate and arranged at the display region and the peripheral region; a first conductive pattern arranged at the peripheral region and electrically connected to the common electrode line; an insulation layer covering the first conductive pattern and the common electrode line, a via-hole being formed in the insulation layer, an orthogonal projection of the via-hole onto the base substrate not overlapping an orthogonal projection of the common electrode line onto the base substrate; and a second conductive pattern arranged at the peripheral region and at a side of the insulation layer distal to the first conductive pattern, and electrically connected to the first conductive pattern through the via-hole.