Surface Mount Stud Carrier for High Current PCB Heat Sink Connection
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Solution Overview
Problem
Current high power applications lack a reliable method for connecting printed circuit boards directly to heat sinks with high current connections, as existing solutions like through-hole components and power taps are not suitable for surface mount configurations or direct adhesion to heat sinks.
Innovation Solution
A surface mount stud carrier assembly with an environmental sealing system, comprising a circuit board with conductive elements, a surface mount stud carrier, and a housing with inserts and bosses that allow studs to extend through openings, providing a compressive seal and efficient heat conduction while preventing direct load transfer to the circuit board.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If through-hole type electronic components are used for high power applications, then high current connections can be achieved, but access to both sides of the board is required and the component cannot be used with direct heat sink adhesion
Solution Approach 1:
The invention divides the connection system into separate functional elements: a surface mount stud carrier with conductive elements that attaches to the PCB surface, and a separate stud that threads into the carrier. This segmentation allows the carrier to be mounted on one side of the board while the stud extends through to provide high current connections, eliminating the need for through-hole components and dual-side access.
Solution Approach 2:
The invention transitions from a two-dimensional through-hole connection (requiring access to both sides of the board) to a three-dimensional surface mount configuration with vertical stud extension. The stud carrier sits on the PCB surface while the stud extends perpendicularly through the board, providing high current connections without requiring holes through the board or access to the opposite side.
2Reliability
If power taps with threaded holes are used for high power applications, then high current connections are achieved, but the device cannot be used in surface mount configuration or with direct heat sink adhesion
Solution Approach 1:
The stud carrier is designed to perform multiple functions: it provides mechanical mounting for the stud, establishes electrical connections through conductive elements, and enables both surface mount and direct heat sink adhesion configurations. The carrier's universal design allows it to adapt to different mounting scenarios without requiring through-hole components or specialized power tap structures.
Solution Approach 2:
The invention changes the mounting parameters from traditional through-hole or power tap configurations to a surface mount configuration with adjustable stud extension. The stud carrier can be positioned at various heights and configurations, allowing adaptation to different heat sink attachment methods and PCB layouts, thereby increasing versatility across application scenarios.
3Temperature
If surface mount components are used to enable direct heat sink adhesion, then thermal management is improved, but high current connection capability is lost
Solution Approach 1:
The invention merges the thermal management function with the electrical connection function in a single integrated system. The stud carrier with conductive elements provides both the electrical pathway for high current connections and the mechanical interface for direct heat sink adhesion, allowing simultaneous achievement of efficient heat dissipation and reliable high current transmission without compromising either function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables reliable high current connections and efficient heat conduction between the printed circuit board and heat sink, enhancing power handling capacity without requiring through-hole components, while maintaining environmental protection and secure attachment.
Implementation Method 1
The seal is compressed between the heat sink and the housing to provide an environmental seal
Implementation Method 2
efficient heat conduction while preventing direct load transfer to the circuit board
Data Source
AI summary
A circuit board assembly including a circuit board having at least one conductive element attached thereto and at least one surface mount stud carrier mounted on the circuit board and electrically connected to the at least one conductive element.