Soluble Polyimide Resin Composition for Electronics
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Solution Overview
Problem
There is a need for polymeric resin compositions with improved mechanical, adhesive, and dielectric properties for electronic applications, specifically requiring high tensile strength, tensile elongation, glass transition temperature, low coefficient of thermal expansion, good adhesion to copper, and low relative permittivity and loss tangent at high frequencies, while also being curable at lower temperatures with reduced cure times.
Innovation Solution
A resin composition comprising 30-80 weight % of thermosetting resin and 20-70 weight % of soluble polyimide resin, with the thermosetting resin being an arylcyclobutene resin prepared from a mixture of addition polymerizable arylcyclobutene monomers, dienophile monomers, diene monomers, Reversible Addition Fragmentation chain Transfer (RAFT) Agents, and heterocycle containing monomers, and the soluble polyimide resin containing tetracarboxylic acid component residues, diamine component residues, and endcapping compounds with crosslinking groups.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional dielectric resins are used, then good mechanical properties and adhesion can be achieved, but high cure temperatures and excessive cure times are required
Solution Approach 1:
The patent modifies the chemical composition parameters of the dielectric resin by incorporating specific functional groups (carboxylic acid, hydroxyl, amine) and controlling molecular weight distribution to enable lower cure temperatures while maintaining adhesive properties. The resin composition is designed with specific functional group densities that facilitate curing at reduced temperatures without compromising bond strength.
Solution Approach 2:
The patent creates a composite dielectric resin system combining multiple polymer components with complementary properties. This includes blending thermosetting resins with thermoplastic modifiers and adding functional additives that enable low-temperature curing while preserving mechanical strength and adhesion to copper and other substrates.
2Productivity
If conventional dielectric resins are used, then good mechanical properties can be achieved, but excessive cure times are required
Solution Approach 1:
The patent adjusts curing kinetics parameters by incorporating catalysts and controlling the functional group distribution in the resin. This enables faster cure rates that reduce processing time while the crosslink density and network structure are optimized to maintain high tensile strength in the cured product.
Solution Approach 2:
The patent incorporates pre-reacted oligomers and pre-formed crosslinking agents in the resin formulation that are ready to react rapidly during curing. This preliminary preparation of reactive species enables fast cure times without requiring extended processing while achieving full crosslinking and mechanical properties.
3Strength
If high tensile strength and high glass transition temperature are achieved, then mechanical performance is improved, but processing difficulty increases
Solution Approach 1:
The patent controls the molecular weight distribution and functional group density parameters to achieve high tensile strength and glass transition temperature in the final cured product while maintaining low viscosity in the uncured state. This allows the resin to be easily processed and applied, then cured to achieve the target mechanical properties.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves enhanced mechanical and dielectric properties, improved adhesion to copper, and reduced cure temperatures, enabling its use in various electronic devices and applications such as spin-on dielectric packaging and coatings.
Implementation Method 1
addition polymerizable arylcyclobutene monomers
Implementation Method 2
cure the resins at lower temperatures without excessive cure times
Data Source
AI summary
There is provided a resin composition from a mixture including: (a) 30-80 weight % of at least one thermosetting resin; and (b) 20-70 weight % of at least one soluble polyimide resin. The resin composition can be used in electronics applications.