Bump Height Metrology Using Triangulation and Interferometry

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Solution Overview

Problem

Existing visual light-based triangulation methods fail to accurately measure the height difference between the top of bumps and the upper surface of a partially transparent top layer due to the unknown virtual penetration depth, leading to unreliable measurements.

Innovation Solution

A method and system that combines white light triangulation with interferometry to measure the height difference, using first and second radiation to account for measurement errors, where the second radiation does not penetrate the top layer, and employs extrapolation to correct for errors in the first measurements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If visual light based triangulation is used to measure bump height, then measurement speed is improved, but measurement precision deteriorates due to unknown virtual penetration depth

Engineering Contradiction:
Improvemeasurement speedVSAvoidheight measurement accuracy
Core Design Contradiction:
ProductivityVSMeasurement precision

Solution Approach 1:

The measurement process is divided into two distinct phases: a first measurement phase using white light triangulation for rapid scanning of all bumps, and a second measurement phase using interferometry for precise measurement of a subgroup. This segmentation allows each method to operate in its optimal regime, combining speed and precision throughout the measurement process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A correction factor is introduced as an intermediary element that bridges the two measurement methods. The correction factor, derived from comparing the fast but imprecise triangulation measurements with the slow but precise interferometry measurements, is then applied to all triangulation measurements to compensate for the virtual penetration depth effect, enabling both speed and precision.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Measurement precision

If interferometry is used to measure bump height, then measurement precision is improved, but measurement time increases

Engineering Contradiction:
Improveheight measurement accuracyVSAvoidmeasurement duration
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The measurement process is divided into two distinct phases: a first measurement phase using white light triangulation for rapid scanning of all bumps, and a second measurement phase using interferometry for precise measurement of a subgroup. This segmentation allows each method to operate in its optimal regime, combining speed and precision throughout the measurement process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The fast white light triangulation measurements serve a dual purpose: they provide rapid initial data for all bumps and simultaneously serve as a reference to calculate the correction factor when compared with the interferometry measurements. This self-service approach allows the faster method to contribute to improving the accuracy of the slower method without requiring separate calibration procedures.

Inventive Principle:
Principle #25Self-service

3Area of stationary object

If white light triangulation is used for height measurement, then measurement coverage is improved, but measurement accuracy deteriorates due to virtual penetration depth

Engineering Contradiction:
Improvemeasurement coverageVSAvoidheight measurement accuracy
Core Design Contradiction:
Area of stationary objectVSMeasurement precision

Solution Approach 1:

The measurement process is divided into two distinct phases: a first measurement phase using white light triangulation for rapid scanning of all bumps, and a second measurement phase using interferometry for precise measurement of a subgroup. This segmentation allows each method to operate in its optimal regime, combining speed and precision throughout the measurement process.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system uses feedback from the interferometry measurements to correct the triangulation measurements. By comparing the two measurement methods and calculating a correction factor based on the known relationship between them, the system continuously refines the height measurements, ensuring both comprehensive coverage and high accuracy.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Provides accurate and reliable height difference measurements between bumps and the top layer surface by minimizing measurement errors through a combination of triangulation and interferometry, offering a trade-off between accuracy and time efficiency.

Implementation Method 1

The light changes its propagation angle when entering the top layer—due to a difference between the refraction index of the air and the refraction index of the top layer

Methodology Applied
Scientific EffectRefraction: Refraction

Implementation Method 2

While the light is reflected by the top surface of the base layer

Methodology Applied
Scientific EffectReflection: Reflection

Implementation Method 3

performing second measurements of height differences between a subgroup of the bumps and a subgroup of the corresponding areas, by illuminating the subgroup of the bumps and the subgroup of the corresponding areas with second radiation that does not penetrate the layer

Methodology Applied
Scientific EffectInterference: Interference

Data Source

PatentUS12474162B2Bump measurement height metrology
Publication Date: 2025.11.18 CAMTEK LTD
  • US12474162B2 patent drawing
  • US12474162B2 patent drawing
  • US12474162B2 patent drawing

AI summary

A method for measuring height differences between tops of multiple bumps of an upper surface of a layer, the method may include performing first measurements of the height differences between the bumps and the corresponding areas, by illuminating the bumps and the corresponding areas with first radiation; wherein the first measurements are subjected to first measurement errors; and determining the height differences between the bumps and the corresponding areas based on the first measurements and the first measurements errors.