Optically Investigating Flaws/Contamination TRIZ Cases

Infrared imaging with focal-position scanning reveals subsurface wafer defects and measures defect depth more accurately.

An inclined wedged glass with attached particles converts subsurface depth into horizontal displacement for faster, more accurate optical calibration.

MEMS mirrors replace bulky DLP optics to enable compact handheld 3D surface defect detection with stitched laser and RGB images.

Optical beam scanning reconstructs 3D TGV cross sections without cutting glass, reducing inspection cost while revealing internal structures.

Direct steam generation in a vaporization chamber creates a uniform droplet coating for optical inspection of reflective or transparent surfaces.

Separate plate rotations enable fast multi-angle imaging of 3D objects while reducing mechanical defects and electronic errors in inspection.

Optical and x-ray signal modeling estimates random geometric and material variation in patterned semiconductor structures with higher metrology accuracy.

THz and MMW imaging are combined to inspect closed containers, improving hidden-item detection, tamper identification, and image detail.

A staggered telecentric lens layout gives an optical line sensor deep depth of field and long working distance without added optical complexity.

A single beam-shaping channel creates multiple azimuth angles by adjusting diffractive optics, cutting inspection complexity and cost.

Separate circular plates split object positioning and object rotation to capture multi-angle 3D images faster with fewer mechanical defects.

A non-conductive nano-spacer preserves photoluminescent emission near metal surfaces, improving semiconductor defect detection sensitivity.

Symmetric overlapping lighting zones and synchronized sensors keep container images consistent across orientations for defect and dimension inspection.

Flat-lamp transmission imaging helps detect foreign matter and inner-surface defects in wafer containers more reliably than visual inspection.

Combining white light triangulation with interferometry corrects virtual penetration depth errors for accurate bump height measurement.

Real-time stage offset feedback shifts light emission and image capture timing to reduce wafer inspection noise and distortion.

Line-shaped light-dark transitions let a camera localize reflective surface defects quickly without full geometry reconstruction or heavy calibration.

Simultaneous regular and irregular reflection imaging helps distinguish uneven and patterned metal strip defects with less processing complexity.

A condensing lens boosts light efficiency and uniformity for hairpin inspection, improving brightness contrast without adding more LEDs.

Synchronizing StatCoeff and HistValue updates improves Rice parameter derivation, boosting video coding efficiency and parallel decoding.

Synchronized HistValue and StatCoeff updates keep Rice derivation aligned across CTUs, improving compression efficiency and parallel decoding.

Synchronized StatCoeff and HistValue updates improve Rice parameter accuracy at TU boundaries while supporting parallel video decoding.

A dual-laser probing approach isolates target circuit signals from electro-optical crosstalk to improve fault detection in dense chips.

Exposure time and illuminator brightness are tuned to keep key pixel values in range, reducing ambient light error and saturation in inspection imaging.

Diffused-light imaging and automated defect detection inspect a continuously conveyed thermoformed sheet without stopping die-cut production.

Automated imaging, laser measurement, and machine learning detect wireline cable defects during fast insertion and retrieval, enabling real-time alerts.

Optical sensing and sample classification enable continuous particle monitoring, helping construction sites adapt protection for respirable silica.

Internal and external light sources plus a diffusive medium enable rapid, accurate thickness measurement of colored glass containers with varying walls.

A diffuser and angled light-source layout provide uniform illumination for compact inspection while reducing reflections that disrupt defect images.

An AI-guided crawler combines 2D imaging and 3D laser scans to quantify barrel defects, reduce manual error, and predict remaining life.

Terahertz reflection sensing identifies defects in fast-moving strand products without contact, separating defect signals from lateral movement.

Plane mirrors replace distortion-prone concave optics to project sharp shadow images for rapid, reliable defect detection in injection-molded parts.